Lead Process Engineer – SiCGaN Power Modules

Key Responsibilities

• LeadSiC/GaN power module prototyping assembly and test activitiesin a cleanroom manufacturing environment with a strong focus on process repeatability and production readiness
• Driveprocess development process optimization and continuous improvement initiativesto improve yield throughput cycle time quality and manufacturability
• Identify process bottlenecks variation drivers and waste across manufacturing flows and implement corrective and preventive actions
• Applylean manufacturing principles and problem-solving methodsto improve safety quality delivery and cost performance
• Lead root cause investigations on product and process issues and implement sustainable corrective actions to prevent recurrence
• Troubleshoot existingSiC power module products and manufacturing processes identify failure mechanisms and improve process capability
• Evaluate new materials process parameters tooling and manufacturing methods to improve product performance reliability and ease of manufacture
• Support qualification activities forpower semiconductors materials assembly processes and test methods
• Develop refine and standardize manufacturing methods to support consistent execution from prototype through production transition
• Perform and interpretacceptance testing including pass/fail analysis trend review and out-of-range condition assessment
• Conductfailure analysison defective components and assemblies using destructive and non-destructive techniques to drive process learning and corrective action
• Operate and support process equipment such asdie bonders wire bonders stencil printers reflow/soldering systems plasma cleaners and ovens
• Program and optimize automated assembly tools includingbonders dispensers and pick-and-place systems to improve consistency repeatability and efficiency
• Use advanced test and inspection equipment such asacoustic microscopy (CSAM) electrical curve tracers pull-shear testers and other characterization tools to assess product and process performance
• Measure and analyze components and assemblies to identify variation failure mechanisms and opportunities to improve process robustness
• Maintain and improvebills of materials (BOMs) process travelers reference documents work instructions and test/process instructionsto ensure clear standard work and manufacturing discipline
• Establish and sustain process documentation that supports training repeatability traceability and production control
• Communicate technical status process risks improvement opportunities and recommendations clearly to management and cross-functional stakeholders
• Train mentor and support technicians and assemblers to ensure safe standardized high-quality and on-time execution
• Partner with sustaining electrical quality manufacturing and supply chain teams to ensure products meetcustomer requirements derived technical requirements and manufacturing readiness expectations
• Champion a culture oflean manufacturing standard work visual management and continuous improvementacross module development and assembly activities

Required Qualifications

Education

• Bachelors or Masters degreein Engineering or a related technical field

Experience

• Minimum of2 years of electronics manufacturing or process engineering experiencein a cleanroom environment

Technical Qualifications

• Experience troubleshootingmanufacturing assembly or process issuesin a cleanroom environment
• Demonstrated experience drivingprocess improvement waste reduction yield improvement or cycle time reduction
• Working knowledge of equipment such asdie bonders wire bonders stencil printers soldering/reflow systems and related assembly tools
• Experience withelectronic test inspection and troubleshooting techniquesto the component level
• Understanding of materials used in power module or electronics assembly including:
  • varieties ofsolder preforms and solder paste
  • conductive and non-conductive adhesives
  • conductors and dielectrics
  • varieties ofsilicone potting materials
• Familiarity withcleanroom operating protocols and maintenance requirements
• Knowledge oflean manufacturing principles standard work root cause problem solving and continuous improvement methods
• Ability to work in a cleanroom environment for extended periods of time while wearing required cleanroom attire

Preferred Qualifications

• Experience withSiC and/or GaN power modules
• Experience inpower electronics packaging semiconductor assembly or advanced electronics manufacturing
• Experience supportingprototype builds new product introduction (NPI) production ramp or production transition
• Background infailure analysis process characterization qualification testing or manufacturing yield improvement
• Experience programming or optimizingautomated assembly equipment
• Demonstrated ability to lead technical work influence cross-functional teams and drive measurable process improvements
• Experience applyinglean toolssuch as root cause analysis standard work visual management process flow improvement or defect reduction methods

Work Environment

This role requires hands-on work in aClass 10000 cleanroom environmentfor extended periods. Required attire may include full cleanroom gowning hair net face mask and other cleanroom PPE as applicable.

Additional Information

GE will only employ individuals who are legally authorized to work in the United States for this opening. Any offer of employment is conditioned upon the successful completion of a background investigation and drug screen.

This role requires access to U.S. export-controlled information. Therefore employment will be contingent upon the ability to prove that you meet the status of a U.S. Person as one of the following: U.S. lawful permanent resident U.S. Citizen have been granted asylee or refugee status (i.e. a protected individual under the Immigration and Naturalization Act 8 U.S.C. 1324b(a)(3)).