Wireless Chip Architect

Ceva is at the forefront of the Smart Edge revolution with innovative state-of-the-art Silicon and Software solutions that enable products to Connect Sense and Infer. Our advanced wireless technologies including Bluetooth Wi-Fi UWB and Cellular IoT are integrated into over a Billion devices annually. We are offering you a unique opportunity to shape and make a great impact on the roadmap of connected devices.

In this role you will be at the intersection of cutting-edge wireless technology and direct customer engagement. As a Wireless Architect you drive the definition of connectivity subsystem architectures for next-generation products including Wi-Fi Bluetooth and UWB with mixed analog/digital hardware. You will also serve as a key technical partner for our customers leading technical pre-sales co-develop joint solution offerings and bring a creative flexible mindset to solving complex real-world connectivity challenges. This requires both architectural depth and strong product engineering experience from concept through productization.

Drive full-system view of how the connectivity subsystem interacts within an SoC including CPU/processor memory and peripheral interfaces

Definition of connectivity subsystem architecture specifications including :

• Feature-set definition and PPA (Power Performance Area) targets

• Definition of system low power modes and PMU requirements

• Definition of HW and SW interfaces of the connectivity sub-systems including: HW interfaces state machines operation sequences etc.

• Analog and digital domains partitioning

• Lead technical discussions with customers presenting connectivity architecture options and value propositions

• Co-develop joint solution offerings with customers and partners acting as technical advisor during system integration phases

• Support post-tape-out testing production validation and productization of wireless connectivity solutions

• Lead or contribute to production-readiness activities including silicon characterization yield analysis and qualification testing

• Work closely with logic design physical design firmware and validation teams to ensure successful implementation

• Support wireless subsystem integration process from architectural definition through implementation lab integration and test coverage planning

• Collaborate with product management and business development stakeholders to translate customer feedback into architectural requirements and product roadmap inputs
  

• . or in Electrical Engineering

• Deep understanding of full-system SoC architecture with emphasis on how connectivity subsystems interact with processors memory controllers power domains and software stacks

• Product engineering experience: deep understanding of full lifecycle including post tape-out testing silicon bring-up productization and production qualification.

• Experience in system definition for wireless communication systems

• Experience in wireless communication standards (such as WiFi/BT/Cellular/UWB)

• Experience in ASIC design and architecture with proven experience in successful tape-outs and production

• Knowledge in performance and power modeling and analysis

• Deep understanding of VLSI development process and methods

• Technical leadership

• Strong communicator able to translate complex architectural concepts for customers executives and engineering teams.

• Creative and flexible mindset: comfortable navigating ambiguous requirements and proposing pragmatic innovative solutions

• Proven customer facing experience. Leading technical discussion building trust and influencing design decisions.

• Knowledge in RF integration and performance optimization

• Previous experience with 3rd party IP integration

• Knowledge in CPU/Processor architecture