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Test Engineer

Foxconn WI


Job Location:

Mount Pleasant, TX - USA

Monthly Salary: Not provided by the employer
Posted: 26 August 2026 (16 hours ago)
Application Deadline: 23 November 2026
Vacancies: 1 Vacancy

Job Summary

FII USA Inc. a Foxconn Technology Group Company is seeking a Test Engineer to develop and manage test processes and expand test capacity for printed circuit board assemblies. Once a part of the team you will be responsible for a wide variety of tasks within the Testing Department in a production environment and have the opportunity to display critical thinking skills to expand your career in Smart Manufacturing.

The Test Engineer will develop plans for process optimization and test capacity utilization for Surface Mount Technology (SMT) lines support new product introductions and assist the Testing Department as needed.

Responsibilities

  • Develop and implement plans for test processes and test capacity utilization across SMT production lines.
  • Manage and maintain functional test programs for PCBA testing.
  • Train and develop operators on proper use of test equipment and test procedures.
  • Provide technical support to SMT operations related to testing and drive optimization of test processes.
  • Support test engineering validation for new PCBA products and prepare detailed NPI reports and recommendations for customers.
  • Track daily repairs and downtime of production test equipment; analyze data and recommend corrective actions to improve test efficiency.
  • Review current test equipment and facilities against present and future requirements to ensure test readiness and customer satisfaction.
  • Coordinate with vendors and procurement teams to source fixtures tooling and equipment required for test setups.
  • Troubleshoot electronic PCBAs and assemblies and recommend process or design improvements.
  • Coordinate with Maintenance to drive preventative maintenance programs for test equipment.
  • Act as a technical escalation point for daily production test issues responding to line requests and engaging external resources as needed.
  • Participate in PFMEA activities and New Product Introduction (NPI) projects.
  • Other Duties as assigned.

Qualifications

  • Bachelors degree required; Bachelors degree in Electrical Engineering or related field preferred.
  • 02 years of experience in printed circuit board assembly processes methodologies standards and best practices.
  • Knowledge of SMT test processes including FVT FT and FBT at the board level.
  • Working knowledge of test engineering principles electronic equipment and mechanical and pneumatic test systems.
  • Strong analytical problem-solving verbal and written communication skills.
  • Ability to work independently with minimal supervision while meeting deadlines in a fast-paced production environment.

Reasons you should work for us:

  • Comprehensive benefits package including medical dental and vision insurance coverage.
  • Basic life insurance and short-term disability coverage provided by employer.
  • Supplemental life insurance and long-term disability coverage options available.
  • 401K with employer contribution.
  • Personal Vacation and Holiday paid time off for all full-time employees.
  • Onsite Aurora Health & Wellness Center available for all employees.
  • Employees are continuously encouraged to learn and grow their careers in smart manufacturing.

Required Experience:

IC


About Company

Foxconn's Science and Technology Park located in Wisconsin is a 3,000-acre campus. Over $1 Billion has been invested by Foxconn in its development in Mt. Pleasant, Wisconsin. The Foxconn Wisconsin project has captured the attention of future developers and partners across the world.

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