Staff Package Design Engineer

In this role you will work at the intersection of IC design advanced package development and system-level implementation. You will play a critical role in designing and delivering next-generation high-performance semiconductor package solutions including power modules chiplet-based architectures FCBGA SiP WLCSP wire-bonded QFP and QFN packages supporting automotive SoCs industrial IoT microcontrollers and AI-enabled embedded computing platforms. This role requires strong technical depth in package layout execution manufacturability assembly process constraints and cross-domain co-design with global silicon design signal integrity/power integrity thermal reliability and product engineering teams.

Key Responsibilities

• Execute package layout design and development for advanced package technologies including power modules FCBGA SiP WLCSP and multi-chip modules.
• Develop and maintain package CAD databases ensuring accuracy and adherence to package design guidelines DFM and DFA requirements to support manufacturability yield and long-term reliability.
• Manage the package design cycle including schematic creation netlist import footprint assignment layout implementation verification and generation of manufacturing release outputs such as Gerber/drill data fabrication drawings assembly drawings bump maps and related documentation.
• Create and modify substrate and RDL layouts bump maps escape routing stack-up structures and power/ground distribution features.
• Collaborate with SI/PI thermal reliability DFT silicon design product engineering and manufacturing teams to support package-level co-optimization and participate in design reviews.
• Ensure package designs comply with applicable foundry OSAT substrate vendor and manufacturing design rules including DRC LVS connectivity and netlist verification requirements.
• Support Engineering Change Order cycles design updates revision control and release documentation throughout the project lifecycle.

Qualifications :

• 4 years of hands-on experience in package CAD layout substrate design or advanced package development; 6 years preferred.
• Strong background in power module packaging FCBGA SiP WLCSP advanced substrate-based packages and multi-die/chiplet-based package architectures.
• High proficiency with industry-standard package design tools such as Cadence Allegro Package Designer / SiP Layout Siemens Xpedition Substrate Integrator or equivalent CAD platforms.
• Proven experience applying advanced package design rules substrate vendor constraints OSAT assembly requirements DFM/DFA principles and manufacturing release standards.
• Experience interfacing directly with Tier-1 OSATs substrate suppliers foundries silicon design teams and product engineering teams.
• Working understanding of SI/PI fundamentals high-speed routing impedance control power/ground distribution and crosstalk mitigation.
• Strong communication presentation and technical documentation skills with demonstrated experience working effectively in global cross-functional engineering environments.

Education

• Bachelors or Masters degree in Electrical Engineering Microelectronics Materials Science or a related technical discipline.

Additional Information :

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industrial Infrastructure and IoT shaping a safer healthier greener and smarter future.

At Renesas TAGIE is our culture grounded in being Transparent Agile Global Innovative and Entrepreneurial. It shapes how we work grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Remote Work :

No

Employment Type :

Full-time