Sr. Staff Principal Physical Design Engineer

About the Company:

At SK hynix memory solutionswere at the forefront of semiconductor innovation developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in NAND flash technology and memory solutions we drive the evolution of advancing mobile technology empowering cloud computing and pioneering future technologies. Our cutting-edge memory technologies are essential in todays most advanced electronic devices and IT infrastructure enabling enhanced performance and user experiences across the digital landscape.

Were looking for innovative minds to join our mission of shaping the future of technology. At SK hynix memory solutions you will be part of a team thats pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. Were not just adapting to technological change were driving it with significant investments in artificial intelligence machine learning and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of whats possible in semiconductor technology we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.

About the Role

Join our Physical Design(SoC Integration) team responsible for delivering high-performance SoC designs from RTL to GDS. As a Sr. Staff Physical Design Engineer you will lead physical implementation efforts for advanced-node designs driving critical blocks through synthesis placement CTS routing and signoff. You will work closely with front-end DFT power and analog teams to optimize PPA (Power Performance Area) while ensuring silicon success. This role requires deep hands-on expertise across the full physical design flow as well as leadership to mentor junior engineers and define methodologies for the team.

Responsibilities

• Lead physical design implementation from synthesis through GDS for high-performance blocks or full-chip SoC designs in advanced process nodes (7nm 5nm 3nm)
• Execute and optimize synthesis placement clock tree synthesis (CTS) and routing using industry-standard P&R tools (Synopsys ICC2/Fusion Compiler or Cadence Innovus)
• Drive timing closure and signoff using PrimeTime (PT) including advanced analysis such as SI AOCV/POCV crosstalk and ECO implementation
• Perform RC extraction using StarRC or Quantus and ensure strong correlation between extraction and STA results
• Own physical verification signoff with Mentor/Siemens Calibre resolving DRC LVS ERC and antenna violations in complex FinFET layouts
• Conduct power integrity analysis using Ansys RedHawk(Redhawk-SC) including static/dynamic IR drop and EM analysis; implement power grid and decap optimizations
• Develop and maintain physical design flows and automation scripts (Tcl Perl Python) mentor junior engineers and collaborate with cross-functional teams to achieve tapeout schedules

Minimum Qualifications

• Bachelors degree in Electrical Engineering Computer Engineering or related field (Masters preferred)
• 8 years of hands-on experience in ASIC physical design with proven tapeout success
• Expert-level proficiency in synthesis placement CTS and routing using Synopsys or Cadence P&R tools
• Deep knowledge of static timing analysis (STA) and PrimeTime signoff including multi-corner/multi-mode closure
• Demonstrated experience with physical verification using Calibre (DRC LVS ERC) and IR drop/EM analysis using RedHawk

Preferred Qualifications

• Experience at 5nm or 3nm process nodes with FinFET and multi-patterning design rules
• Familiarity with low-power design techniques including UPF clock gating multi-Vt and voltage islands
• Strong programming skills in Tcl Perl and Python for flow automation and data analysis
• Knowledge of ECO implementation and clock reconstruction (CRPR useful skew) methodologies
• Experience leading or mentoring a team of physical design engineers on complex SoC projects
• Exposure to memory-centric interfaces and systems such as SSD SoC HBM or HBF (High Bandwidth Flash) base die designs (a plus not required)
• Familiarity with chiplet and die-to-die (D2D) interconnect technologies including Universal Chiplet Interconnect Express (UCIe) or equivalent D2D PHY protocols (a plus not required)

COMPENSATION: $160000/yr - $220000/yr

REGARDING COMPENSATION:

SK hynix memory solutions America Inc. offers you the opportunity to apply your skills to exciting projects while working with innovative teams. Our compensation package is complimented by a generous benefits package including medical dental vision life insurance and a company 401(k) match as well as cafeteria onsite gym and much more. If you are motivated by technical challenges we offer a collaborative work environment that encourages career growth.

The salary offered to a selected candidate will be tailored based on several factors including the location job grade relevant knowledge skills and experience. We also take into account the internal equity among our current team members to ensure fairness and competitiveness.