Specialist, Materials Process Engineer

Job Title:Specialist Material Process Engineer

Job Code: 41733

Job Location: Mason Ohio

Job Schedule: 9/80: Employees work 9 out of every 14 days- totaling 80 hours worked- and have every other Friday off

Job Description:

L3Harris Technologies is seeking aSemiconductor Process Engineerfor the Focal Plane Array team at our Mason OH location. As aSemiconductor Process Engineer you will support a variety of wafer fabrication tools and processes perform data analysis for development and production work identify process issues and process optimization opportunities perform root cause analysis and drive mitigation strategies perform qualification activities for new processes and tools and provide sustaining engineering support in a manufacturing area. You will have regular interactions with equipment vendors operations management equipment maintenance technicians and development engineering teams.

Essential Functions:

• Utilize semiconductor processing techniques to develop optimize and own production processes.
• Utilize MES for operations management process tracking and monitoring.
• Qualify set up and operate semiconductor wafer equipment for III-V semiconductor manufacturing.
• Monitor Statistical Process Control (SPC) and Fault Detection Control (FDC); identify process drifts and potential excursions.
• Perform Design of Experiments (DOEs) and process verification for new tools and processes.
• Perform data-driven root cause investigation efforts for process and equipment issues.
• Implement improvements for efficiency cost reliability and quality
• Develop and maintain detailed process equipment and operational documentation.
• Maintain a safe and organized work environment ensuring ISO/ANSI compliance with safety protocols and standards.
• Ability to train and mentor technicians and engineers on process equipment and procedures.
• Ability to obtain US security clearance.

Qualifications:

• Bachelors Degree and minimum 6 years of prior relevant experience. Graduate Degree and a minimum of 4 years of prior related lieu of a degree minimum of 10 years of prior related experience.
• 3 year experience working in a Class 100 cleanroom or similar environment.

Preferred Additional Skills:

• Experience in semiconductor manufacturing processes such as wet chemical plasma dry etching thin film deposition and/or assembly processes (Substrates Wire bonding PnP).
• Strong organizational verbal and written communication skills.
• Experience working with III-V semiconductor devices and manufacturing.
• Familiar with using statistical data analysis software (e.g. Minitab JMP) for process optimization and control.
• Coding background with experience in programming languages such as Python C or similar would be optional but highly beneficial.
• Demonstrated problem-solving skills with a strong sense of responsibility ownership and follow-through.
• Proven team player with a proactive and customer-oriented mindset and a sense of urgency to achieve job goals.
• Continuous improvement focused with the ability to implement and sustain process improvements.

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