Senior Staff, Technical Program Management, Power Package NPI

Own the execution of Renesas strategic AI/Datacenter Infrastructure Power package engineering and New Product Introduction (NPI) programs from development and qualification through production ramp in a fast-paced high-growth environment. You will collaborate with product Technical Program Managers (TPMs) and personnel embedded at key global OSATs to deliver committed schedules and quality reliability and production-readiness objectives.

You will partner closely with Package Engineering leadership Power product group teams and OSAT/CM partners escalating critical risks early and leading cross-functional technical task forces on issues that threaten quality reliability yield manufacturability cost or schedule.

KEY RESPONSIBILITIES

• Lead Technical Program Management execution for strategic AI/Datacenter Infrastructure Power NPI and package engineering programs directly managing complex programs as needed.
• Partner with Package Engineering Directors and technical leads providing program-level execution leadership governance and accountability while keeping technical ownership clear and unduplicated.
• Establish and drive end-to-end NPI program plans milestones critical paths and resource alignment to achieve committed schedules.
• Establish a disciplined program management operating model covering development qualification customer requirements production readiness ramp and transition to volume manufacturing.
• Continuously improve standardized processes templates metrics escalation mechanisms and lessons-learned practices and drive consistent execution standards across internal teams and strategic OSAT locations.
• Proactively identify technical quality reliability supply manufacturing and schedule risks and establish mitigation plans.
• Escalate critical issues with clear recommendations and decision points.
• Lead cross-functional technical task forces collaborating closely with internal teams and external partners (OSAT/CM customers) on issues that threaten quality reliability yield manufacturability qualification schedule or customer commitments including process-integration and assembly problems.
• Drive root-cause analysis and data-based decisions and hold corrective/preventive actions through to closure.
• Coordinate closely with Power product group partners (Design Application Marketing) Product Engineering Reliability Quality Operations and Supply Chain to remove execution barriers and maintain program momentum.
• Establish program dashboards and management systems giving transparent visibility into milestones critical path risks issues action owners and recovery plans.
• Collaborate and drive key OSAT/CM partners through program reviews milestone tracking issue escalation and recovery plans.
• Ensure Engineering Build Requests (EBRs) are executed on committed schedule at each OSAT tracking progress identifying delays and driving recovery actions.
• Align OSAT/CM development activities (DOE process optimization process-window verification production controls) and qualification and ramp readiness with overall NPI program objectives..
• Build strong working relationships with OSAT/CM executive and technical leadership to improve responsiveness accountability and execution of critical AI/Datacenter Power programs.
• Ensure effective transition from development and qualification into production through readiness reviews ramp monitoring and issue management.
• Provide concise fact-based communication to directors and senior leadership on program health critical risks schedule recovery resource needs and decisions required.
• Support package technology roadmap execution by translating strategic priorities into executable programs milestones resources and deliverables.

LEADERSHIP & ORGANIZATIONAL RESPONSIBILITIES

• Translate organizational priorities into team objectives staffing recommendations performance expectations and development plans.
• Foster a culture of urgency fact-based decision making cross-functional collaboration ownership and rapid issue resolution.

Qualifications :

• Bachelors degree or higher in Electrical Mechanical Chemical or Materials Engineering; Materials Science; Physics; Chemistry; or a related technical discipline.
• 12 years of relevant experience in semiconductor engineering product development applications package development NPI manufacturing technical program management or a closely related field including experience leading complex cross-functional programs.
• Demonstrated experience managing complex semiconductor NPI programs involving package development assembly qualification reliability and manufacturing ramp.
• Strong understanding of semiconductor product development process package and assembly processes.
• Hands-on experience in Power Management products particularly with several of these: power SiP/modules Smart Power Stages Vertical Power Stages Power Modules Discrete FET packages battery management system PMICs wafer-level and/or flip-chip technologies.
• Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations.
• Proven track record leading cross-functional technical task forces and resolving complex issues involving quality reliability yield manufacturability and schedule.
• Strong understanding of qualification reliability SPC/statistical methods process development risk management and structured problem-solving methodologies.
• Strong program management skills including critical-path management risk management executive escalation schedule recovery and cross-functional resource alignment.
• Strong interpersonal communication negotiation and presentation skills including the ability to communicate effectively with senior leaders.
• Ability to influence technical and business leaders without direct authority and drive accountability across organizational boundaries.
• Strong analytical skills and ability to translate complex technical issues into clear business impact decisions and actions.
• Willingness to travel domestically and/or internationally approximately 1020% of the time including to OSAT/CM sites.

PREFERRED QUALIFICATIONS

• Experience supporting high-growth high-visibility customer programs.
• Familiarity with wide-bandgap (SiC/GaN) devices power-module substrates (DBC/AMB) multi-chip or advanced interconnect technologies
• Experience with formal technical program management methodologies and portfolio-level governance.
• Experience driving customer-critical NPI programs in a fast-paced high-growth environment.

SUCCESS MEASURES

• On-time achievement of NPI milestones and customer commitments.
• Reduction in schedule delays caused by unresolved technical quality reliability or manufacturing issues.
• Timely closure of critical cross-functional task-force actions.
• Improved qualification yield reliability and production-readiness performance.
• Effective execution and alignment of strategic OSAT/CM partners.

Additional Information :

Renesas offers a full range of elective benefits including medical health savings account (with applicable medical plan) dental vision health and/or dependent care flexible spending accounts pre-tax commuter benefits life insurance AD&D and pet addition to elective benefit options benefited employees receive company-paid life insurance and AD&D LTD short term medical benefits as well as paid sick time paid holidays and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industrial Infrastructure and IoT shaping a safer healthier greener and smarter future.

At Renesas TAGIE is our culture grounded in being Transparent Agile Global Innovative and Entrepreneurial. It shapes how we work grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Remote Work :

No

Employment Type :

Full-time