Senior Manager, Package Design Engineering

Responsibilities:

• Lead package technology development and NPI execution including R&D activities coordination with global OSAT partners for new package development and product qualification technology roadmap implementation project budget tracking and customer adoption programs.

• Manage the design and development of package and interconnect solutions for Renesas AI and data center infrastructure power products including Smart Power Stages Vertical Power Stages Power Modules and discrete FET packages.

• Support wide-bandgap SiC and GaN package development DBC and AMB substrates advanced interconnect technologies wafer-level packaging flip-chip multi-chip modules and power devices.

• Evaluate select and qualify materials processes assembly subcontractors (OSATs) and contract manufacturers in alignment with product requirements quality standards cost targets and capacity needs.

• Partner with OSATs and contract manufacturers to plan and execute DOEs optimize assembly processes establish process specifications and close technical gaps.

• Coordinate with Product Groups Design Applications Quality Operations and Reliability teams to qualify new packages and processes within committed schedules.

• Drive resolution of package and process integration issues ensuring robust process-window validation and risk assessment for critical manufacturing steps.

• Define and implement production controls monitors and corrective actions to prevent quality incidents and improve manufacturing robustness.

• Ensure smooth technology transfer into production and manage ramp-up monitoring issue escalation yield improvement and readiness reviews.

• Work closely with OSATs and contract manufacturers to identify and resolve early-production process issues and ensure products meet quality reliability delivery and customer requirements.

• Maintain strong technical expertise in power SiP/modules wafer-level packaging flip-chip interconnects advanced substrates and emerging power-package technologies and translate industry developments into executable programs.

• Contribute to packaging roadmap development and lead execution of assigned technology and product-development programs including schedules resources risks and cross-functional deliverables.

• Lead technical response and corrective-action activities for internal and external customer concerns partnering with Marketing Product Groups Quality Operations and Supply Chain teams.

• Establish document and maintain package design rules and engineering standards.

Qualifications :

• Masters or Bachelors Degree in Physics Chemistry Mechanical Engineering Electrical Engineering Materials Engineering or a related discipline; doctorate is a plus.

• 12 to 15 years of relevant semiconductor package development experience including technical or project leadership responsibility with emphasis on power SiP/modules wafer-level packaging and flip-chip packaging.

• Strong understanding of power SiP/modules wafer-level and flip-chip packaging methods assembly processes package and product qualification reliability methods SPC DOE and statistical analysis tools. Knowledge of wire-bonding multi-chip modules SiC/GaN packaging and advanced substrates is preferred.

• Demonstrated ability to lead cross-functional technical teams manage multiple development programs influence global manufacturing partners and escalate risks with clear recovery plans.

• Strong interpersonal written and verbal communication skills.

• Strong analytical problem-solving project management and presentation skills.

Additional Information :

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industrial Infrastructure and IoT shaping a safer healthier greener and smarter future.

At Renesas TAGIE is our culture grounded in being Transparent Agile Global Innovative and Entrepreneurial. It shapes how we work grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Remote Work :

No

Employment Type :

Full-time