Semiconductor Operations Advanced SiP Packaging

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The Apple Semiconductor Operations team is looking for a motivated highly technical Component SiP productization engineering focusing on product and process development supplier readiness and high-volume manufacturing role will drive NPI execution process bring-up qualification readiness and quality improvement for advanced SiP RF antenna mmWave wireless and high-density module successful candidate will work with module integration suppliers OSATs sub-component vendors PCB/substrate suppliers and system integration sites. They will interface regularly with Engineering Operations Reliability and Quality teams.

Deliver high-density and high-performance SiP/module technologies within thermo-mechanical performance reliability quality cost and form-factor Advance Component SiP and system integration development for future products including design rules process bring-up materials/process quality readiness at vendor factories for development builds risk ramp and mass supplier readiness across NPI phases including process BKM lock build-exit criteria factory audits qualification status and ramp-risk process yield reliability and quality issues in product and manufacturing data analysis and failure analysis to identify gaps in component design package architecture process capability inspection coverage and test with vendors and OEM/system integration sites to ensure compliance to Apple specifications and manufacturing qualification and reliability activities at suppliers are in line with product and process requirements.n Partner closely with component design hardware engineering reliability PD FEA/simulation operations and quality teams.n Provide routine status reporting to leadership and escalate technical quality and supplier execution issues when needed.

Strong SiP semiconductor packaging module assembly or advanced packaging experience including knowledge of assembly processes materials substrates and package-level failure mechanisms.n5 years relevant experience in product engineering process engineering semiconductor packaging module productization supplier quality or high-volume in Electrical Engineering Mechanical Engineering Materials Science Chemical Engineering or related technical disciplinenUnderstanding of SPC DOE FMEA JMP or equivalent data analysis tools and factory quality metrics used to monitor production understanding of reliability testing and failure mechanisms such as temperature cycling board-level reliability MSL bHAST CAF warpage solder fatigue and substrate/material interpersonal skills to work with design development operations reliability quality supplier engineering and other cross-functional teams.

Hands-on experience with supplier manufacturing process control quality systems factory audits and production readiness to take advanced packages or modules from concept and development builds to high-volume with RF mmWave antenna module wireless module high-density package or advanced SiP architecture is a to communicate technical risk clearly drive issue closure and provide concise executive-level -motivated good communicator and able to lead complex issues across global suppliers.