Principal Signal and Power Integrity Engineer

Microsoft Silicon Cloud Hardware and Infrastructure Engineering (SCHIE) is the team behind Microsofts expanding Cloud Infrastructure and responsible for powering Microsofts Intelligent Cloud mission. SCHIE delivers the core infrastructure and foundational technologies for Microsofts over 200 online businesses including Bing MSN Office 365 Xbox Live Teams OneDrive and the Microsoft Azure platform globally with our server and data center infrastructure security and compliance operations globalization and manageability solutions. Our focus is on smart growth high efficiency and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.

The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design development manufacturing and packaging of Microsofts state-of-the-art computer chips notably the Azure Cobalt. Our solutions provide sustainable strategic advantage to Microsoft and enable our customers to achieve more.

As Microsofts cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time in high volume with high quality and lowest cost is of paramount importance. To achieve this goal the Signal and Power Integrity Team team is instrumental in defining and delivering operational measures of success for hardware manufacturing improving the planning process quality delivery scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are looking for aPrincipal Signal and Power Integrity Engineer to join the team.

#SCHIE #CSME

The SMPE silicon team is seeking a passionate driven and intellectually curious computer/electrical engineer to deliver premium-quality designs once considered impossible. We are responsible for delivering cutting-edge custom IP and SoC designs that can perform complex and high-performance functions in an extremely efficient manner.

• PI engineer for compute and AI SoCs and platforms Implement strategies for end-to-end power delivery design from Silicon to Package and linking to Platform to System and Cloud
• Deliver SIPI solutions that meet the HPC demands across the entire system.
• Drive future power delivery solutions for chiplet architecture with advanced packaging and advanced silicon nodes
• Design model and simulate PI (i.e. incl. IP design voltage regulator motherboard CPU package silicon and decoupling capacitor solution) for data center processors and corresponding platforms to ensure optimized performance. Performs DC AC and transient simulation to provide noise impedance profile of the whole power delivery path and link/electrical simulations to validate I/O performance from platform to silicon.
• Work closely with silicon and platform architects motherboard and package designers thermal architects and engineers and power and performance engineers.
• Drives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise industry practices and lessons learned from teams working across multiple product lines
• Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.

Required Qualifications:

• Doctorate in Electrical Engineering Computer Engineering Computer Science or related field AND 3 years technical engineering experience OR Masters Degree in Electrical Engineering Computer Engineering Computer Science or related field AND 6 years technical engineering experience OR Bachelors Degree in Electrical Engineering Computer Engineering Computer Science or related field AND 8 years technical engineering experience OR equivalent experience.

Preferred Qualifications:

• MSEE degree with 10 years experience in silicon packaging products development
• Experience with power integrity modelling for HPC products
• Strong foundation in advanced packaging technologies as it relates Power integrity
• Experience with Foundry Silicon technologies OSAT technologies and Substrate technologies
• MS degree with minimum 7 years of experience in silicon/package/system power integrity/delivery

• BSEE degree with minimum 10 years experience in silicon/package/system power integrity/delivery
• Experienced in the field of Power Integrity and delivery System design IP design with knowledge on product development with minimum 7 years experience in design and electrical modelling
• Good working knowledge in the field of end to end system SIPI Design and Architecture
• Industry knowledge trends and landscape of technologies to drive development across Silicon-IP Advanced packaging Substrate technology Board technology and Platform design
• Interpersonal skills including written and verbal communication teamwork negotiation and presentation

Screening Requirements

• Ability to meet Microsoft customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
• This role will require access to information that is controlled for export under export control regulations potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations the EU Dual Use Regulation and/or other export control a condition of employment the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g. under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement and as a condition of employment the successful candidates citizenship will be verified with a valid passport. Lawful permanent residents refugees and asylees may verify status using other documents where applicable.
  
  

Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $142800 - $274800 per year. There is a different range applicable to specific work locations within the San Francisco Bay area and New York City metropolitan area and the base pay range for this role in those locations is USD $188000 - $304200 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
position will be open for a minimum of 5 days with applications accepted on an ongoing basis until the position is filled.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age ancestry citizenship color family or medical care leave gender identity or expression genetic information immigration status marital status medical condition national origin physical or mental disability political affiliation protected veteran or military status race ethnicity religion sex (including pregnancy) sexual orientation or any other characteristic protected by applicable local laws regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process read more about requesting accommodations.

Required Experience:

IC