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Principal Application Engineer – semiconductor packaging
Job Location:
Job Location:
Irvine, CA - USA
Yearly Salary:
USD 130000 - 155000
Yearly Salary:
Posted:
29 September 2026 (2 days ago)
Posted:
Application Deadline:
27 December 2026
Application Deadline:
Vacancies:
1 Vacancy
Vacancies:
Job Summary
OPEN JOB: Principal Application Engineer semiconductor packaging
LOCATION:Irvine California
***Relocation Assistance Available
INDUSTRY:Manufacturing & Production
BASE SALARY: $130000 to $155000
This position is with our clients Adhesive Technologies business unit (adhesives sealants and functional coatings)
What youll do
Requirements:
If you are interested in pursuing this opportunity please respond back and include the following:
Upon receipt one of our managers will contact you to discuss the position in full detail.
STEPHEN FLEISCHNER
Recruiting Manager
INTERMEDIA GROUP INC.
EMAIL:
LINKEDIN: Experience:
LOCATION:Irvine California
***Relocation Assistance Available
INDUSTRY:Manufacturing & Production
BASE SALARY: $130000 to $155000
This position is with our clients Adhesive Technologies business unit (adhesives sealants and functional coatings)
What youll do
- Develop and evaluate KPI results and drive innovation and continuous improvement via data driven decisions and actions
- Leverage semiconductor knowledge in advanced packaging e.g. 2.5D HBM CoWoS technical requirement and trend to accelerate material testing and test vehicle development
- Primary technical interface to leading edge clients addressing and resolving issues related to product implementation functionality or performance
- Responsible for application functions and tasks to sales marketing PD and other business units
- Manage a small (2-4) Application Engineering team to achieve project deliverables
Requirements:
- Bachelors degree in Materials Science Chemical Engineering Mechanical Engineering or related field
- 12 years of experience in semiconductor packaging or processes with people manager experience
- Solid understanding of current and emerging packaging trends including 2.5D and 3D packaging
- Proven ability to work independently and lead technical discussions with customers
- Strong communication skills with a customer-focused ownership-driven mindset
- Effective project and time management skills with a consistent focus on quality and delivery
- Willingness to travel up to 10%
- Ability to take meetings with our APAC team during off-hours
If you are interested in pursuing this opportunity please respond back and include the following:
- MS WORD Resume
- required compensation.
- Contact information.
- Availability
Upon receipt one of our managers will contact you to discuss the position in full detail.
STEPHEN FLEISCHNER
Recruiting Manager
INTERMEDIA GROUP INC.
EMAIL:
LINKEDIN: Experience:
Staff IC
About Company
your search ends here innovative staffing solutions for job seekers as well as corporate and government clients nationwide for over 20 years View All Our Openings About Us Intermedia Group, founded in 1996, provides expert staffing services for our clients’ full time salaried employee ... View more
