Packaging Substrate Engineer

Our Hardware Technology Packaging team invents designs develops and integrates electronic packaging solutions for Apples internal and custom external components of hardware for its consumer electronic products such as iPhone iPad Mac Apple Watch Apple TV this highly visible role you will own and drive sophisticated package selection new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design technology manufacturing and reliability and future roadmap; and work with cross-functional teams to achieve the best package performance.

Lead SoC package substrate technology development pathfinding and roadmap definition. nWork with substrate manufacturing industry foundry and OSAT to bring package substrate solution from concept to industry with sophisticated package solutions new architecture material and process development and spec definitions. n5% International travel

Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging with cross-functional groups to define u0026 optimize new package substrate architectures based on performance technical risk cost and availability solving of technical issues during the full product development cycle.

Minimum requirement of a bachelors degree

MS and or Ph.D. and 3 years of relevant industry -depth knowledge of substrate technology manufacturing process design rules and -on experience in substrate manufacturing and technology development: Cu plating lithography dielectric material via formation solder resist surface finish with package assembly and integration process in Cadence Allegro platform tools and design review for manufacturing (DFM).nExceptional technology development u0026 project management communication u0026 collaborative skills.