NAND Product Development Engineer

We are seeking a senior NAND Product/Test Development Engineer and technical leader to drive test strategy and innovation for next-generation NAND Flash memory products. This role is responsible for leading burn-in or high-speed I/O test development guiding junior engineers and driving cross-functional projects across Design Process Reliability Manufacturing and SSD teams. The successful candidate will influence product quality reliability test cost and technology roadmap decisions while enabling industry-leading QLC and PLC NAND solutions for AI-driven datacenter storage applications.

Major Responsibilities

• Lead the development and optimization of burn-in reliability screening and high-speed I/O test methodologies for NAND Flash products.
• Drive electrical validation test coverage improvement yield enhancement and test cost reduction initiatives across NAND products.
• Lead root cause investigations of complex test and product failures through statistical analysis electrical failure analysis and cross-functional collaboration.
• Provide technical leadership for new product introduction (NPI) test program development qualification and manufacturing ramp.
• Lead cross-functional projects involving Design Process Reliability Manufacturing OSAT and SSD engineering teams.
• Mentor and guide junior engineers on test methodology development failure analysis data interpretation and technical problem solving.
• Define and drive backend test roadmap initiatives including test time reduction screening optimization and next-generation test technology deployment.
• Work closely with SSD engineering teams to enable NAND component and SSD system co-optimization for quality and reliability improvements.

Qualifications :

• Masters degree in Electrical/Electronic Engineering Computer Engineering Semiconductor Circuits or related fields.
• 5 years of experience in NAND memory product engineering test engineering or reliability engineering.
• Strong knowledge of statistical data analysis electrical failure analysis and semiconductor test methodologies.
• Experience with NAND Flash architecture burn-in screening high-speed I/O testing and manufacturing test optimization preferred.
• Demonstrated technical leadership and ability to lead cross-functional projects and mentor engineers.
• Strong communication collaboration and problem-solving skills.

Additional Information :

This position is also eligible to participate in Solidigms restricted stock unit (RSU) restricted cash unit (RCU) and cash bonus addition Solidigm offers a benefits package that includes medical dental vision supplemental life and AD&D insurance; short- and long-term disability; healthcare and dependent care flexible spending accounts and a company match on eligible 401(k) plan contributions.

The compensation range for this role is $121280 - $194100.  Actual compensation is influenced by a variety of factors including but not limited to skills experience qualifications and geographic location.

Powered by SmartRecruiters - Candidate Privacy Policy

Remote Work :

No

Employment Type :

Full-time