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Memory Circuit Design Principal Engineer, HBM

Micron

Job Location:

Richardson, TX - USA

Monthly Salary: Not provided by the employer

Posted: 8 June 2026 (30+ days ago)

Application Deadline: 5 September 2026

Vacancies: 1 Vacancy

Job Summary

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

Microns Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML high-performance computing (HPC) and data-centric systems collaborating across global engineering and product teams to deliver industry-leading performance power efficiency and reliability!

HBM product family is growing due to high demand from industry leading semiconductor companies. As a HBM Memory Design Engineer in sustaining role you will be working with teams like Design Engineering (DE) Product Engineering (PE) Process Integration Packaging and Technology Development (TD) on evaluating silicon issues seen on all the current HBM designs. You will interact with the architecture team to understand new or modified specification requests and you will work with the team on implementing and verifying the design supporting the design release to silicon and all future needs arising for the design. You will have an opportunity to rotate to a Design Engineer role and work on the next generation HBM products.

Responsibilities will include but are not limited to:

Design digital analog and memory core circuits using complementary metaloxidesemiconductor (CMOS) logic and transistorlevel techniques from concept through productionready solutions.
Model parasitics and support design validation reticle experiments and required revisions for initial and subsequent tapeouts.
Create and guide optimized floorplans for placement routing power delivery networks sense margins array timing and die size including layout leadership.
Simulate and verify designs using industrystandard tools such as FineSim HSPICE (Simulation Program with Integrated Circuit Emphasis) FastSPICE and Verilog hardware description language.
Analyze and optimize power delivery networks to meet performance reliability and efficiency targets.
Debug and identify root causes for presilicon and postsilicon issues in current High Bandwidth Memory (HBM) products driving effective solutions.
Collaborate with standards computeraided design (CAD) modeling and verification teams and lead design reviews and status updates to communicate progress and technical decisions.

Minimum Qualifications:

Bachelors or Masters degree in Electrical Engineering or a related field or equivalent practical experience.
8 years of relevant experience with a Bachelors degree or 6 years with a Masters degree.
Extensive knowledge of CMOS circuit design and semiconductor device physics.
Handson experience with schematic entry and circuit simulation using Verilog FastSPICE and HSPICE.
Strong understanding of timing area power and complexity tradeoffs in Dynamic RandomAccess Memory (DRAM) or mixedsignal design.

Preferred Qualifications:

Experience clearly communicating complex technical concepts in written and verbal form.
Experience with scripting or automation using Python Tool Command Language (TCL) Perl or similar.
Exposure to registertransfer level (RTL) design flows in DRAM or foundry processes.
Experience with DRAM product bringup and silicon debug.
Exposure to advanced packaging technologies such as throughsilicon vias (TSV) hybrid bonding interposers or similar.

As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.

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To learn more about Micron please visit US Sites Only: To request assistance with the application process and/or for reasonable accommodations please contact Microns People Organization at or 1- (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However all information provided must be accurate and reflect the candidates true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology Inc.

Required Experience:

Staff IC

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