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Manager, Hardware Engineering

CesiumAstro


Job Location:

Westminster, CA - USA

Yearly Salary: $ 184000 - 225500
Posted: 1 September 2026 (17 hours ago)
Application Deadline: 29 November 2026
Vacancies: 1 Vacancy

Job Summary

Please Note:To conform with the United States Government Space Technology Export Regulations the applicant must be a U.S. citizen lawful permanent resident of the U.S. conditional resident asylee or refugee (protected individuals as defined by 8 U.S.C. 1324b(a)(3)) or eligible to obtain the required authorizations from the U.S. Department of State.

AtCesiumAstro we are developers and pioneers of out-of-the-box communication systems for satellites UAVs launch vehicles and other space and airborne platforms. We take pride in our dynamic and cross-functional work environment which allows us to learn develop and engage across our organization. If you are looking for hands-on interactive and autonomous work CesiumAstro is the place for you. We are actively seeking passionate collaborative energetic and forward-thinking individuals to join our team.

We are seeking an Engineering Manager Digital & Mixed-Signal Hardware to lead and coordinate our high-speed digital electronics teams across multiple sites and product lines. This leadership role is critical to ensuring design consistency and high-quality execution across a diverse portfolio of software-defined radios space computing platforms and phased array control systems.

This position is a highly technical leadership role responsible for delivering well-engineered digital and mixed-signal hardware on schedule across all product lines. The role provides technical ownership for board- and system-level high-speed digital designs while leading functional team execution staffing and engineering process maturity in a fast-growing aerospace and defense startup environment.

In addition to people and process leadership this role contributes hands-on technical expertise to critical designs architecture reviews and complex debug activities ensuring products are scalable manufacturable testable and robust at production volumes.

This front-line engineering management role is the perfect fit for excellent engineers who want to grow their impact. If you are passionate about designing great hardware have strong interpersonal skills and are excited by the prospect of designing teams to make more hardware than you can on your own this is the role for you.

Some engineering management experience is preferred but not required. The successful candidate may be a senior or principal engineer motivated to take the next step in their career.

JOB DUTIES AND RESPONSIBILITIES
  • Maintain technical integrity and engineering excellence for high-speed digital and mixed-signal electronics development across the company.
  • Establish mature scale and enforce engineer-friendly digital hardware development processes including high-speed interface design guidelines signal integrity simulation workflows and schematic and layout standards for dense high-layer-count PCBs
  • Lead and participate in rigorous architecture and design reviews ensuring appropriate subject matter expert (SME) engagement across digital RF power firmware and mechanical disciplines.
  • Apply strong working knowledge of adjacent disciplines RF electronics power electronics mechanical engineering software to ensure board- and system-level success.
  • Contribute directly to board-level digital and mixed-signal designs as needed particularly in high-risk or schedule-critical programs.
  • Lead or support complex debug efforts involving high-speed interfaces large FPGA and processor implementations and related technical topics.
  • Ensure digital hardware designs are buildable and testable at scale using DFM and DFT best practices.
  • Drive disciplined handoff from engineering to manufacturing through close collaboration with manufacturing engineering supply chain and production test engineering.
  • Ensure designs meet quality reliability and scalability requirements for aerospace and defense production environments.
  • Partner with Supply Chain to ensure component availability lifecycle risk mitigation and cost awareness.
  • Drive design reuse modular architectures and platform commonality across products to accelerate execution and reduce risk.
TEAM LEADERSHIP STAFFING & PERFORMANCE RESPONSIBILITIES
  • Build scale and lead a high-performing digital and mixed-signal hardware engineering team.
  • Advocate for realistic schedules while holding the team accountable to delivery commitments.
  • Lead hiring activities including writing job descriptions conducting interviews and making hire/no-hire decisions.
  • Establish clear development paths and growth opportunities for high-performing engineers.
  • Address performance issues promptly and constructively.
  • Actively close skill gaps through hands-on mentorship training initiatives or targeted hiring.
  • Provide one-on-one coaching mentoring and deep technical guidance.
  • Serve as a key contributor to early-stage engineering execution planning including collaboration with Business Development and Systems Engineering.
  • Plan and manage budgets related to staffing lab equipment capital equipment and design/simulation software.
  • Maintain strong working relationships across Engineering Quality and Operations.
JOB REQUIREMENTS AND MINIMUM QUALIFICATIONS
  • Bachelors degree or higher in Electrical Engineering or Computer Engineering required.
  • Minimum of 7 years of direct digital or mixed-signal hardware engineering experience preferably in aerospace environments. 13 years of small-team technical leadership or engineering management experience preferred but not required.
  • Demonstrated deep expertise in high-speed digital and mixed-signal board design.
  • Software-defined radio experience preferred.
  • Strong understanding of signal integrity (SI) and timing.
  • Experience supporting design for manufacturability (DFM) design for test (DFT) and transition from development to production.
  • Proven ability to conduct rigorous technical reviews mentor engineers and communicate effectively across disciplines.
  • Ability to balance architectural rigor with execution speed in a fast-paced development environment.
  • Proficiency with high-speed simulation and analysis tools such as Ansys SiWave or ADS SiPro.
  • Deep hands-on experience with schematic capture and PCB layout tools such as Altium.
  • Familiarity with FPGA toolchains (e.g. Xilinx Vivado) preferred.
  • Strong technical and non-technical communication skills.
$184000 - $225500 a year
CesiumAstro considers several factors when extending an offer including but not limited to the role and associated responsibilities a candidates work experience education/training and key skills. Full-time employment offers include company stock options and a generous benefits package including health dental vision HSA FSA life disability and retirement plans.
CesiumAstro is an Equal Opportunity employer. All qualified applicants will receive consideration for employment without regard torace color religion sex national origin disability protected Veteran Status or any other characteristic protected by applicable federal state or local law.

Please note: CesiumAstro does not accept unsolicited resumes from contract agencies or search firms. Any unsolicited resumes submitted to our website or to CesiumAstro team members will be considered property of CesiumAstro and we will not be obligated to pay any referral fees.
We may use artificial intelligence (AI) tools to support parts of the hiring process such as reviewing applications analyzing resumes or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed please contact us.

Required Experience:

Manager


About Company

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CesiumAstro builds high-throughput, software-defined phased array communication payloads for airborne and in-orbit platforms.

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