Lead, Mechanical Engineer (Thermal) Space Optics

Job Title: Lead Mechanical Engineer (Thermal) Space Optics

Job Code: 44597

Job Location: On-site in Palm Bay FL or Fort Wayne IN

Job Schedule: 9/80: Employees work 9 out of every 14 days- totaling 80 hours worked- and have every other Friday off

Relocation: Relocation assistance is available to qualified applicants

Job Description:

L3Harris is seeking an experienced and highly accomplished Lead Thermal Engineer to lead spacecraftlevel thermal design modeling and analysis activities for advanced space based electro-optical missions. This role is responsible for architecting and validating thermal solutions that ensure mission success across multiple orbital environments. The ideal candidate is a recognized technical expert capable of driving complex spacecraft thermal strategy mentoring engineers and collaborating across multidisciplinary teams.

Essential Functions:

• Serve as the technical lead for spacecraftlevel thermal design defining architecture strategies and requirements for highreliability space vehicles.
• Develop detailed thermal models and analyses for all mission phases including worstcase hot/cold environments eclipse conditions orbital variations and missionspecific scenarios.
• Lead creation and validation of thermal control hardwareincluding radiators coatings heat pipes surface finishes insulation heaters and conductive interfaces.
• Own thermal performance budgets and flowdown of requirements to payloads avionics structures and propulsion subsystems.
• Evaluate thermal impacts of system trades configuration changes power profiles and operational timelines.
• Direct development of thermal math models using industry-standard tools such as Thermal Desktop SINDA/FLUINT ESATANTMS or equivalent.
• Provide leadership during spacecraft hardware build integration and testincluding thermal vacuum (TVAC) planning execution anomaly resolution and correlation of test results to analysis.
• Guide environmental considerations for space platforms including radiation conduction convection-free behavior material properties surface degradation and mission life effects.
• Act as a cross-functional leader collaborating closely with systems engineering mechanical design power RF digital hardware manufacturing and mission assurance teams.
• Mentor junior and midlevel engineers establishing best practices and driving continuous improvement in thermal engineering processes.
• Prepare highquality documentation including thermal requirements analysis reports review packages test plans and verification matrices.
• Ability to obtain a US security clearance

Qualifications:

• Bachelor of Science Degree in Engineering and a minimum of 9 years of prior relevant experience. Graduate Degree in Engineering and a minimum of 7 years of prior related lieu of a degree minimum of 13 years of prior related experience.
• 5 years professional experience using Thermal Desktop
• Prior or current professional experience with thermal design and analysis for space environment/products
• 2 years of experience as an IPTL or providing technical leadership to an engineering team

Preferred Additional Skills:

• Experience designing for a space environment.
• Hold a current security Clearance or the ability to obtain a security clearance
• Deep understanding of spacecraft materials thermal coatings MLI conductive interfaces and active thermal control elements.
• Demonstrated success in developing validating and correlating thermal models to TVAC results.
• Ability to lead design reviews guide complex decision-making and communicate clearly with customers leadership and engineering teams.
• Experience working on government DoD or national security space missions.
• Knowledge of mission-specific environments such as GEO LEO cislunar or deep space.
• Broad knowledge of thermal-fluids physics including heat conduction and convection of multi-phase flows
• Experience creating and overseeing the development of thermal testing control logic in SINDA/FLUENT
• Familiarity with structural-thermal-optical (STOP) analysis deployment mechanism thermal behavior or thermal considerations in RF/highpower payloads.
• Experience with reliability assessments derating and longduration thermal performance modeling.