Failure Analysis Engineer

HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance scalable optical components across AI/datacom infrastructure hyperscale computing quantum computing sensing and beyond. Founded in 2018 and backed by leading venture capital weve built a team and a platform focused on real-world mass deployment of TFLN photonics technology.

At the core of our work is the TFLN Chiplet platform - a modular integrated architecture designed for scalability manufacturability and seamless integration into complex systems. It offers a rare combination of extraordinary performance and industrial readiness enabling system developers across applications to deploy the technology fast and ready. We partner with our customers and suppliers from conceptualization design and prototyping phases all the way through mass production to ensure smooth and rapid deployment of TFLN photonic technology.

We believe our platform is the key in the golden age of integrated photonics to empower humanity to the next level. We assembled a world class team covering engineering business and operations. We believe in the power of integrity innovation collaboration and pragmatic solutions. Our diverse team thrives on challenges and is united by a shared commitment to excellence. We take pride in tackling complex challenges with curiosity humility and a deep sense of care for one another.

Failure Analysis currently consists of a small and impactful team. Youll be trained directly by the FA lead and will grow into owning cases independently across the full workflow: intake analysis planning hands-on characterization root cause determination and reporting back to the Test Platform and Engineering teams.

FA at HyperLight is investigative work. Each measurement is one piece of evidence and the job is to assemble those pieces into a defensible picture of what actually happened while resisting the pull of the first plausible story.

What youll do

• Own FA cases end to end: define the question plan the analysis execute it and write it up.
• Sequence analyses correctly on irreplaceable samples; non-destructive before destructive and know when a cross-section is worth spending the only sample you have.
• Run optical microscopy SEM and EDS day to day; FIB cross-sectioning and lift-out; AFM
  profilometry and ellipsometry as needed.
• Perform surface and chemical characterization XPS Raman FTIR and interpret the data not just acquire it.
• Specify and manage outsourced analysis () with external labs.
• Support post-reliability FA on stressed parts (HAST damp heat thermal cycling) and on customer returns working with the Test and Reliability engineers.
• Work in the cleanroom on FA sample preparation and on light fabrication for demo and
  process-feasibility devices: resist processing photolithography e-beam lithography metallization etching (wet dry: ion milling and RIE).
• Write clear evidence-anchored reports that hold up under cross-functional scrutiny and present findings to stakeholders including Platform and Foundry.
• Maintain sample chain of custody case records and the FA findings database.

• Education and experience one of:
• BS in materials science and engineering chemistry applied physics physics electrical engineering or chemical engineering plus 3 years hands-on cleanroom and/or
  characterization experience; or
• MS in one of the above plus 12 years; or
• PhD in one of the above (graduate research counts toward experience)
• Independent cleanroom experience. You have been qualified on and worked unsupervised with at least three of: photolithography and resist processing plasma/RIE etch wet etch thin-film deposition (PVD/CVD/ALD) e-beam lithography. This includes the habits that go with it contamination and particle control strict SOP adherence and legible complete logbooks.
• Independent SEM operation including imaging of insulating and PIC samples plus EDS acquisition and interpretation.
• Experimental rigor. Demonstrated ability to design an analysis with appropriate controls
  identify confounding variables and keep observation separate from inference.
• Technical writing. You can produce a report that a non-specialist stakeholder can act on.
• Comfortable working with acids bases and solvents and willing to complete site-specific safety training including hydrofluoric acid handling.

Preferred

• FIB for cross-sectioning lift-out and TEM lamella preparation.
• XPS data analysis peak fitting charge referencing/correction chemical-state assignment. This is the hardest analytical skill on the list and weighs accordingly.
• TEM or experience scoping and managing outsourced TEM/analytical work.
• Raman FTIR AFM ellipsometry profilometry.
• E-beam lithography.
• Working knowledge of semiconductor and photonic failure mechanisms: galvanic corrosion delamination cracking electromigration ESD.
• Familiarity with JEDEC reliability methods (HAST damp heat thermal cycling).
• Lithium niobate integrated photonics MEMS or III-V process experience.
• Statistical and spectral data analysis (JMP Python).
• Experience presenting technical findings to teams whose processes the findings implicate.

What we look for

Two qualities matter more here than any single tool on the list.

The first is curiosity that doesnt quit the instinct to stop at the odd thing in the corner of
the image rather than move on because it wasnt what you were looking for. Most root causes we find started as an incidental observation someone chose not to ignore.

The second is calibration being willing to say the evidence doesnt yet support a conclusion
and to change your mind when a control comes back wrong. FA findings drive real changes to
production so being confidently wrong is expensive.

Physical and work environment demands

• Work is performed in cleanroom and laboratory environments requiring full gowning (coverall hood face mask gloves shoe covers safety glasses) donned and removed multiple times per day.
• Extended periods of standing and walking in the cleanroom frequently 2 - 4 hours at a stretch with limited flexibility to step away mid-process.
• Manual dexterity and fine motor control are sufficient to handle wafers chips and sub-millimeter features with tweezers under a microscope.
• Close visual acuity (correctable) for microscope and instrument work. Lithography bays operate under filtered yellow lighting.
• Routine work with hazardous chemicals including acids bases and solvents using prescribed PPE. Site-specific safety training is required before working independently.
• Certain characterization instruments generate strong magnetic fields; access to those tools may be restricted for individuals with pacemakers or other implanted medical devices.
• Local travel between the HyperLight office/lab and shared user facilities at Harvard CNS and .
• Occasional off-hours or weekend work when tool availability at shared facilities requires it.
• Extended periods at a workstation for data analysis and report writing.

• Competitive market-based compensation (Salary range $90000 - $180000 per year)
• Comprehensive health coverage including medical vision and dental plans for individuals and families
• 401(k) retirement plans with employee matching
• Paid Parental Leave
• Life and disability insurance
• Commuter benefits and subsidies
• Professional growth and mentorship opportunities

This role is in-person at HyperLights office in Cambridge MA. Authorization to work in the US is required.

HyperLight is an equal opportunity employer. All applicants will be considered for employment without attention to race color religion sex sexual orientation gender identity national origin veteran or disability status. HyperLight is committed to providing reasonable accommodations to individuals with disabilities during our hiring process. If you need assistance or an accommodation please contact us at

Required Experience:

IC