DFM R&D Engineer — Advanced Simulation & Materials

At Apple innovative ideas become extraordinary products through deep engineering rigor and strong cross-functional collaboration. The DFM Ru0026D Lab plays a critical role in developing the materials processes and predictive modeling frameworks that enable advanced semiconductor packaging and microelectronics technologies to scale reliably to high-volume manufacturing. We are seeking an Ru0026D Engineer who is excited to solve complex mechanical challenges connect simulation with real-world data and influence product decisions through thoughtful physics-based analysis.

This position blends finite element simulation with hands-on materials characterization. You will work on semiconductor packages PCB systems and SMT assemblies developing predictive models that inform design direction reliability strategy and manufacturing readiness. Youll partner closely with design reliability and manufacturing teams to define key load cases build and validate material models and reduce risk early in development. Your work will help close the gap between simulation and hardware through disciplined experimentation and correlation.

Develop and execute finite element models (implicit and explicit) for semiconductor packaging PCB structures and SMT assembliesnAnalyze thermo-mechanical behavior including warpage stress evolution drop/shock fatigue and fracturenLead or support material characterization efforts (mechanical physical chemical) for microelectronics materialsnBuild calibrate and validate material models using experimental datanDesign and execute DOEs to correlate simulation with test results and support reliability projectionsnDrive early design optimization and support root cause investigations of mechanical failuresnIntegrate module-level simulations into larger product assembly modelsnCommunicate analysis results clearly to cross-functional stakeholders

7 years of experience in finite element modelingnStrong foundation in solid mechanics and thermomechanicsnExperience with CAE tools such as Ansys Abaqus or equivalentnExperience working with materials used in microelectronics applicationsnMS or PhD in Mechanical Engineering Materials Science Applied Mechanics Chemical Engineering or related field

Experience in warpage fracture mechanics fatigue or drop/impact modelingnFamiliarity with semiconductor packaging and SMT processesnExperience correlating simulation models with physical testingnUnderstanding of DOE methodology and reliability physicsnStrong written and verbal communication skillsnComfortable working in a fast-paced cross-functional environment