Datacenter Compute SoC Architect
California, CA - USA
Job Summary
My clients Data Center team is at the forefront of innovation developing cutting-edge technologies that power the worlds most advanced data centers.
Our team brings together system architects advanced packaging technology developers and SoC design experts to create high-performance power-efficient scalable and reliable solutions for data center applications.
We work collaboratively across disciplines to push the boundaries of compute technology and shape the future of cloud computing and AI infrastructure.
We are seeking a highly experienced and visionary Datacenter Compute SoC Architect to lead the definition design and optimization of companys next-generation high-performance computing SoCs.
In this critical role you will define the system-on-chip architecture for scalable data center processors balancing power performance and area requirements while supporting demanding cloud-scale and AI workloads.
You will collaborate closely with CPU and compute core architects IP designers performance modeling teams packaging engineers and software and firmware teams to deliver world-class silicon solutions.
Key Responsibilities
SoC Architecture Definition
Lead the architectural definition of next-generation data center compute SoCs.
Define core and instance counts cache hierarchies coherent interconnects and memory subsystems.
Establish architectural requirements that support scalable cloud computing and AI workloads.
IP Selection and Integration
Define technical requirements and drive architectural decisions for internal and third-party IP.
Evaluate and integrate technologies including:
o PCIe Gen 5 and Gen 6
o CXL
o DDR5 and HBM memory controllers
o Network-on-Chip architectures
o Security enclaves and related security IP
Power Performance and Area Optimization
Conduct detailed power performance and area trade-off analysis.
Optimize the SoC architecture to meet aggressive data center efficiency scalability and performance-per-watt targets.
Evaluate architectural alternatives and identify the optimal balance between performance cost power consumption and silicon area.
Advanced Packaging Strategy
Collaborate with packaging technology teams on multi-die and chiplet-based architectures.
Define requirements for die-to-die interconnect protocols including UCIe.
Support the development of advanced thermal and packaging solutions for high-performance compute platforms.
Hardware and Software Co-Design
Partner with firmware operating system and cloud infrastructure software teams.
Ensure the hardware architecture effectively supports:
o Modern hypervisors
o Virtualization technologies
o Cloud-native workloads
o Data center operating environments
o AI and high-performance computing applications
Performance Modeling
Work closely with performance modeling teams to define workloads use cases and architectural evaluation criteria.
Guide the development of C and SystemC architectural models.
Analyze simulation results to identify performance bottlenecks and architectural optimization opportunities.
Technical Leadership
Develop detailed SoC architecture specifications and technical documentation.
Serve as the technical lead throughout:
o RTL implementation
o Design verification
o System validation
o Silicon bring-up
Provide architectural guidance and resolve complex cross-functional technical issues.
Qualifications
Education
Bachelors or Masters degree in:
o Electrical Engineering
o Computer Engineering
o Computer Science
o Or a related technical discipline
Professional Experience
10 years of industry experience in one or more of the following areas:
o SoC architecture
o CPU or compute architecture
o System architecture
At least 3 years of experience focused on:
o High-performance server SoCs
o Data center processors
o Network processor SoCs
o Other high-performance infrastructure compute platforms
Technical Expertise
The ideal candidate should have expertise in the following areas:
CPU and Compute Architecture
Deep understanding of high-performance CPU or compute architectures including:
o ARM
o x86
o RISC-V
Coherent Fabrics and Interconnects
Extensive knowledge of coherent fabrics and on-chip interconnect technologies including:
o ARM AMBA CHI
o AXI
o Proprietary Network-on-Chip architectures
o Cache-coherent interconnect protocols
Memory and Cache Architecture
Strong expertise in:
o Memory hierarchy design
o Cache architectures
o Cache coherency protocols
o Memory bandwidth and latency optimization
Experience with main memory technologies including:
o DDR4
o DDR5
o LPDDR
o HBM
High-Speed I/O
Solid understanding of high-speed interfaces and data center connectivity technologies including:
o PCIe
o CXL
o Ethernet
Communication and Collaboration
Exceptional written and verbal communication skills.
Ability to translate complex architectural concepts into clear and actionable specifications.
Proven ability to influence and collaborate with cross-functional engineering teams.
Work Locations
This position is open in the following locations:
San Jose California
San Diego California
Portland Oregon
Austin Texas
Compensation
The base salary range for this position is:
$211000$356000 per year
Employees may also be eligible for:
Performance-based bonuses
Short-term incentive programs
Long-term incentive programs
Actual total compensation will depend on the individuals skills qualifications and relevant professional experience.
Benefits
The company provides a comprehensive benefits package which may include:
Health insurance coverage
Life insurance
Disability insurance
401(k) retirement savings plan
Company-paid holidays
Paid sick leave
Paid vacation
Parental leave
Additional employee benefits and incentive programs
Equal Employment Opportunity
The company is an Equal Opportunity Employer committed to inclusion and diversity.
Employment decisions are made without regard to age ancestry color physical or mental disability family or medical leave status gender gender expression gender identity genetic information marital status medical condition military or veteran status national