Component Quality Engineer
Cupertino, CA - USA
Job Summary
ICComponent quality team manages end to end proactive quality of semiconductor silicon ICs covering Apple silicon latest technologies in the industry such as SoC DRAM/NAND and PMU to passives ASICs and Power ICs. Team manages Apple suppliers semiconductor fab/assembly manufacturing and testing process design debug and FA quality monitoring data analytics machine learning MLB/IC EE application level etc. With excellent Electrical Engineering skills to work with Product Design Test Product Quality Supplier Quality Contract Manufacturers and field organizations to deliver high quality systems. Outstanding program management skill is highly desired.
Vendor (Fab process Wafer level test Final test and Packaging) facility auditing. Full audit reporting communication with Suppliers and Apple management and follow up to close all issues u2028nDrive and track closure on any component or module issues that impact overall product readiness or DPPM fluctuations u2028nFeedback real time learning from any sustaining issues u2028nProvide quality team approval risk and MP releases and ensure team drives quality u2028requirements for any post-ramp qualification u2028nManage all program-related communication to executive management including: u2028Highlight key program risk to management and clearly explain path to resolution u2028nCommit to work under high time/deliverable pressure with solid results u2028nActively participate in detection of component quality u0026 manufacturing issues u2028during development u2028nManage quality reviews audits and support at vendor/CM sites u2028nPrevent and correct quality issues during the sustaining phase nIn this role you will be also responsible for managing all aspects of logic board quality design quality components and assemblies n
Experience in one or more of the following disciplines: Fab Process Operations Test Design or Product Engineering Reliability and/or Qualification nExperience in design u0026 manufacturing of systems PCBAs assembly and test nBroad IC packaging experience i.e. WLCSP SOC QFN etc. nSolid knowledge and experience in Fab process and Package assembly. nu2028Strong product reliability knowledge and fundamentals of relevancenExcellent skills in failure analysis of systems circuits and their components including cross-sectional analysis Optical Microscopy X-Ray SEM/EDS FTIR XPS etc.
Familiar with test strategies: In-Circuit Testing board functional tests and industry standard test methodologies such as JTAG. nDrive technical root cause analysis and corrective actions to improve system quality.u2028 nAdapt at identifying risk and develop solid plans to mitigate nElectrical Engineering skills including familiarity with circuit and system design and manufacturing processes and test. nPrecise technical communication including deep level of engineering analysis and details. nDemonstrated initiative with a high level of energy and methodical u0026 efficient problem solving skills including engineering DOEs. nExperience in system manufacturing SMT and transitioning new products into manufacturing. nProven 8D and RCCA based problem solving and transformation. A high level of experience with quality metrics and leadership (such as ASQ) and consumer electronics experience is preferrednExperience working with off-shore manufacturers and traveling to manufacturing sites to perform root cause findings and problem solving u2028
Required Experience:
IC
About Company
Ask Siri to name the most successful company in the world and it might respond: Apple. And it's not just out of familial pride. Apple consistently ranks highly in profit, revenue, market capitalization, and consumer cachet. In 2018, the company became the first reach a trillion dollar ... View more