CCA Board Design Engineer (Engineer Electrical 3)
Job Location:
Syracuse, NY - USA
Monthly Salary:
Posted:
Application Deadline:
Vacancies:
Job Summary
Requisition Number:29497
Required Travel: 0 - 10%
Employment Type:Full Time/Salaried/Exempt
Anticipated Salary Range:$90486.00-$145000.00
Security Clearance:Ability to Obtain
Level of Experience:Mid
This opportunity resides with Warfare Systems (WS) a business group within HIIs Mission Technologies division. Warfare Systems comprises cyber and mission IT; electronic warfare; and C5ISR systems.
HII works within our nations intelligence and cyber operations communities to defend our interests in cyberspace and anticipate emerging threats. Our capabilities in cybersecurity network architecture reverse engineering software and hardware development uniquely enable us to support sensitive missions for the U.S. military and federal agency partners.
Leadership at HII Mission Technologies
HIIs Leadership Capability Framework defines the standard of excellence expected of all leaders across Mission Technologies. Leaders are accountable for modeling these capabilities and building them within their teams:
- Know & Grow Your People Develop talent empower teams and build an inclusive environment.
- Build Relationships Strengthen trust collaboration and cross-functional partnerships.
- Take Ownership Drive accountability execution excellence and results.
- Customer First Anticipate mission needs and deliver value to our partners.
- Shape the Future Inspire innovation and align work with strategic priorities.
- Act with Urgency Make informed decisions and move with purpose.
These capabilities define how leaders inspire teams deliver results and shape the future of Mission
Huntington Ingalls Industries Mission Technologies division is seeking a highly skilled and motivated CCA Board Design Engineer 3 to join our growing engineering this role you will be responsible for the PCB design and layout of complex high-reliability Circuit Card Assemblies (CCAs) and Printed Circuit Boards (PCBs) utilized in cutting-edge defense national security and electronic warfare systems.
As a Level 3 engineer you will act as a technical lead on complex design tasks collaborating closely with systems mechanical thermal and software engineers to deliver robust hardware solutions from conceptual design through production.
- Full Lifecycle Design: Lead layout design of complex multi-layer high-speed digital analog and mixed-signal CCAs as well as assist in schematic capture and documentation.
- Technical Leadership: Guide junior engineers and design layout specialists through complex routing challenges high-speed signaling constraints and power distribution network (PDN) design.
- DFx Optimization: Apply Design for Manufacturing (DFM) Design for Testing (DFT) and Design for Assembly (DFA) principles to ensure seamless transition from design to full-scale production.
- Cross-Functional Collaboration: Partner with Mechanical and Thermal Engineers to ensure proper physical integration structural integrity and thermal dissipation of the CCAs within rugged environments.
- Documentation: Generate comprehensive engineering documentation packages including schematics bills of materials (BOMs) fabrication drawings and assembly instructions.
- Education & Experience: Bachelors degree in Electrical Engineering Computer Engineering or a related STEM field with a minimum of 5 years of relevant experience; OR a Masters degree with 3 years of relevant experience.
- EDA Tool Proficiency: Demonstrated expert-level experience with industry-standard PCB design suites (e.g. Altium Designer Siemens EDA/Mentor Graphics Xpedition or Cadence Allegro).
- Technical Expertise: Strong background in designing multi-layer boards utilizing high-density interconnect (HDI) microvias controlled impedance and fine-pitch BGA components.
- Component Knowledge: Proven experience selecting components and designing circuits featuring FPGAs processors high-speed memory interfaces and power management units (PMUs).
- Active Secret clearance.
- Familiarity with aerospace/defense standards such as MIL-STD-810 IPC-2221/2222 and IPC-A-610.
- Experience with RF/Microwave board layout and isolation techniques.
- Familiarity with Altium Designer and Altium component and project databases
- Experience utilizing simulation tools like HyperLynx Ansys HFSS or Keysight ADS for Signal Integrity and Power Integrity analysis.
- Strong written and verbal communication skills with the ability to present technical design reviews (PDR/CDR) to internal management and external clients.
The listed salary range for this role is intended as a good faith estimate based on the roles location expectations and responsibilities. When extending an offer HIIs Mission Technologies division takes a variety of factors into consideration which include but are not limited to the roles function and a candidates education or training work experience and key skills.
Together we are working to ensure a future where everyone can be free and thrive.
All qualified applicants will receive consideration for employment without regard to race color religion gender gender identity or expression sexual orientation national origin physical or mental disability age or veteran status or any other basis protected by federal state or local law.
Do You Need Assistance
If you need a reasonable accommodation for any part of the employment process please send an e-mail to and let us know the nature of your request and your contact information. Reasonable accommodations are considered on a case-by-case basis. Please note that only those inquiries concerning a request for reasonable accommodation will be responded to from this email address. Additionally you may also call 1- for assistance. Press #3 for HII Mission Technologies.
Required Experience:
IC
