Capital Equipment Hardware engineer Advanced Packaging

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the worlds technology.

What We Offer

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Youll benefit from a supportive work culture that encourages you to learn develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possiblewhile learning every day in a supportive leading global company. Visit our Careers website to learn more.

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Applied Materials is seeking a Global Product Support (GPS) Engineer( Capital Equipment Hardware engineer ) to support installation startup qualification and ongoing operation of the Kinex Hybrid Bonding platform being deployed for the CTO advanced packaging development programs.

The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities BESI Applied Materials product engineering teams and CTO process development teams.

This role combines hands-on equipment support system integration startup execution facilities coordination and vendor engagement. The engineer will play a key role in establishing Kinex as a strategic advanced packaging platform supporting die-to-wafer hybrid bonding optical interconnect and next-generation heterogeneous integration development.

• Support Kinex installation activities from tool dock through release to engineering users
• Coordinate Tier 0 Tier 1 and Tier 2 startup activities
• Drive closure of installation punch-list items
• Support factory acceptance and site acceptance activities with vendors
• Develop recovery plans for installation and startup issues

• Support Facility Data Sheet (FDS) development and updates
• Coordinate with Facilities EHS and infrastructure teams
• Define and validate tool utility requirements
• Support hookup and qualification activities

• Perform troubleshooting of mechanical electrical automation and process-related issues
• Develop preventative maintenance procedures
• Support uptime improvement efforts
• Analyze equipment performance and reliability trends
• Drive root cause investigations and corrective actions

• Act as primary technical interface with BESI and Kinex product engineering teams
• Coordinate technical reviews service activities upgrades and modifications
• Manage escalation of hardware and software issues
• Support implementation of engineering changes and new capabilities

• Support hybrid bonding process development activities
• Work closely with CTO process engineers and researchers
• Enable wafer-to-wafer and die-to-wafer bonding development
• Support new module integration and experimental hardware evaluations

• BS in Mechanical Engineering Electrical Engineering Mechatronics Systems Engineering or related engineering discipline
• 37 years of engineering experience in semiconductor equipment new college graduates applications will NOT be considered
• Experience supporting semiconductor manufacturing or development equipment
• Strong troubleshooting and root-cause analysis skills
• Excellent verbal and written communication skills
• Ability to work across facilities vendors process engineering and operations teams

• Experience with advanced packaging equipment
• Experience with hybrid bonding wafer bonding die attach packaging or assembly systems
• Experience with wet clean processes and systems
• Equipment installation and startup experience
• Facilities hookup and utility integration experience
• Vendor management and supplier coordination experience
• Hands-on experience troubleshooting complex semiconductor equipment

• Knowledge of:
  • Automated material handling systems
  • Vacuum systems
  • Plasma processing systems
  • Wet processing equipment
  • Metrology systems
• Experience generating or reviewing:
  • Site prep / installation documentation
  • Equipment specifications
  • Startup plans
  • Qualification procedures

• Prior experience with BESI equipment
• Hybrid bonding process knowledge
• 300 mm equipment experience
• Project management experience
• Cleanroom construction or tool installation experience

Additional Information

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The salary offered to a selected candidate will be based on multiple factors including location hire grade job-related knowledge skills experience and with consideration of internal equity of our current team addition to a comprehensive benefits package candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program as applicable.

For all sales roles the posted salary range is the Target Total Cash (TTC) range for the role which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.

In addition Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process please contact us via e-mail at or by calling our HR Direct Help Line at option 1 and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.