Service & Support Manager

About the Role

Our client a global supplier of high-precision die bonding and micro-assembly equipment is building out its APAC service capability from its new Thailand office and is seeking a Service & Support Manager to lead technical service and customer support across Thailand and the wider APAC region.

This is a senior role with regional ownership suited to an experienced service leader from semiconductor equipment precision automation or a comparable high-tech environment.

Key Responsibilities

• Define and execute the service strategy for Thailand and APAC aligned with global service standards
• Track and improve service KPIs including response times resolution rates and customer satisfaction
• Plan resourcing and engineering capacity across the region
• Manage customer escalations ensuring rapid resolution and clear stakeholder communication
• Coordinate with headquarters on technical issues product feedback and field engineering matters
• Oversee spare parts management tooling and field support logistics
• Drive process improvements across the service function
• Lead mentor and develop the regional technical service team

What Were Looking For

• Proven experience managing technical service or field service operations ideally within semiconductor equipment or comparable capital equipment industries
• Strong people management and team leadership track record
• Solid technical foundation with an engineering degree or equivalent experience
• Customer-first mindset with strong escalation management skills
• Familiarity with KPI-driven service operations and process improvement methodologies
• Good English communication skills both written and spoken
• Willingness to travel within Thailand and APAC
• Must be eligible to work in Thailand

Whats On Offer

• 16 days annual leave
• Performance bonus
• Group health insurance
• Travel allowance

Logistics

• Pathum Thani
• A private car is preferred due to the office location
• Full-time permanent role

About the Company

Our client is a global supplier of high-precision die bonding and micro-assembly equipment supporting semiconductor photonics and advanced packaging applications for over 30 years. With subsidiaries on three continents they deliver local expertise and long-term technical collaboration worldwide.