Sales Engineer
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Job Summary
About the Role
Our client a global supplier of high-precision die bonding and micro-assembly equipment is expanding its APAC team in Thailand to grow its presence in the semiconductor and advanced packaging equipment market. They are looking for a Sales Engineer to lead technical sales activities across Thailand and the broader APAC region.
This is a customer-facing consultative sales role suited to a technically credible engineer with commercial drive and a genuine interest in high-precision technology.
Key Responsibilities
- Drive sales of semiconductor and advanced packaging equipment to customers across Thailand and APAC
- Conduct customer visits develop new opportunities and manage the end-to-end sales cycle
- Coordinate with distributors and channel partners
- Lead technical discussions with engineering and procurement stakeholders at customer sites
- Prepare quotations proposals and commercial documentation
- Support marketing and business development activities including trade shows and industry events
- Provide regional market feedback to headquarters and contribute to APAC strategy
What Were Looking For
- Proven experience in technical sales ideally within semiconductor equipment SMT automation precision engineering photonics or related high-tech industries
- Strong technical foundation with an engineering degree or equivalent experience
- Comfortable engaging both technical and commercial decision-makers
- Self-motivated with strong opportunity development and account management instincts
- Good English communication skills both written and spoken
- Willingness to travel within Thailand and APAC as needed
- Must be eligible to work in Thailand
Compensation
- Base salary: THB 70000 to 90000 per month
- Commission scheme
Whats On Offer
- 16 days annual leave
- Performance bonus
- Group health insurance
- Travel allowance
Logistics
- Pathum Thani
- A private car is preferred due to the office location
- Full-time permanent role
About the Company
Our client is a global supplier of high-precision die bonding and micro-assembly equipment supporting semiconductor photonics and advanced packaging applications for over 30 years. Their platforms support customers from feasibility and prototyping through to high-yield production across applications such as optical transceivers LiDAR modules power devices MEMS RF components and quantum hardware.
