R&D Power Module Section Manager

Job Title: R&D Power Module Section Manager

Job Summary

Our client is seeking an experienced R&D Power Module Section Manager to provide technical leadership for the development and manufacturing of advanced semiconductor power-module products. This position will coordinate cross-functional engineering activities establish product and process-design standards and drive improvements in quality reliability cost and manufacturing performance.

Key Responsibilities

• Serve as the technical leader for power-module development and manufacturing activities.
• Coordinate with Process Engineering Quality Assurance Equipment Engineering Product Management Design Engineering and other relevant teams.
• Establish product-design guidelines and design rules for power-module products.
• Define critical process parameters control requirements material-selection criteria and package-reliability standards.
• Lead process-design process-control and manufacturing-readiness activities for new and existing products.
• Provide technical direction and resolve complex product process quality and reliability issues.
• Review engineering data and ensure appropriate application of SPC DOE APQP FMEA and other quality methodologies.
• Communicate technical requirements risks and solutions to internal stakeholders and customers.
• Drive yield improvement defect reduction process optimization and operational excellence.
• Lead or support cost-reduction projects related to power-module products.
• Coach and develop engineering team members while ensuring projects are delivered according to quality cost and timeline expectations.

Qualifications and Experience

• Bachelors degree or higher in Electronics Electrical Engineering Mechanical Engineering Materials Engineering Chemical Engineering Industrial Engineering or a related field.
• At least eight years of relevant experience in semiconductor assembly power modules wafer-level packaging IC packaging or electronic-module manufacturing.
• Previous experience in a technical leadership project leadership supervisory or engineering-management capacity.
• Strong experience in product or process development material selection assembly and package reliability.
• Strong knowledge of engineering data analysis SPC DOE APQP and FMEA.
• Candidates must have detailed practical knowledge of at least two or three of the following processes:
• Advanced SMT including high-density multilayer or double-sided component assembly.
• Silver or copper sintering including pressure and pressureless sintering.
• Soft-solder die attach.
• Aluminium or aluminium-copper wedge and ribbon bonding.
• Vacuum or formic-acid reflow.
• Advanced flip-chip processes including multi-die stacked-die fine-pitch flip chip and thermo-compression bonding.
• Capillary underfill for fine-pitch flip-chip or thermo-compression bonding applications.
• Advanced copper-clip processes including exposed copper clips.
• Heat-sink or heat-slug attachment.
• Advanced moulding including double-sided moulding low-wire-sweep moulding liquid moulding and compression moulding.
• Low-stress blade or laser-singulation processes.

Key Competencies

• Strong technical leadership and cross-functional coordination skills.
• Excellent analytical decision-making and problem-solving abilities.
• High level of responsibility and attention to detail.
• Quality-focused mindset with a strong commitment to zero-defect manufacturing.
• Ability to communicate effectively with technical teams management and customers.
• Good command of English.