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ASIC Physical Design Engineer, RBKS Camera ASIC

Amazon


Job Location:

Taipei City - Taiwan

Monthly Salary: Not provided by the employer
Posted: 4 July 2026 (30+ days ago)
Application Deadline: 1 October 2026
Vacancies: 1 Vacancy

Job Summary

Join the team that delivers highly differentiated silicon into Ring and Blink battery-powered devices. Our RBKS ASIC team works on state-of-the-art SoCs in a vertically integrated environment to deliver products our customers love. an ASIC Physical Design Engineer on our RBKS ASIC team youll serve as the primary technical interface with our back-end design partners for Tethys and future ASIC programs. You will own the quality of physical design deliverablesfrom synthesis through timing closure and silicon bring-upensuring our custom chips meet PPA (power performance area) and ship on schedule.

Key job responsibilities
Expertise in UPF implementation and verification
Own and review physical design layout timing closure deliverables and package from back-end design partners Drive physical implementation through synthesis floorplanning place and route power/clock distribution congestion analysis and sign-off
Provide DFT expertise including scan insertion MBIST integration and DFT coverage review
Debug silicon failures during ATE testing and drive resolution with design partners
Ensure PPA (power performance area) targets are met; perform IR drop analysis and physical verification
Develop and improve physical design methodologies and automation scripts
Evaluate third-party IP for physical implementation feasibility and provide recommendations
Collaborate closely with RTL designers on architectural feasibility studies and physical-aware design trade-offs


A day in the life
Youll work across time zones with our ASIC design partners reviewing implementation progress analyzing timing reports and driving closure on critical paths. When silicon returns youll be at the center of ATE debug correlating failures to physical design root causes and coordinating fixes with partners.

About the team
Were a small nimble ASIC team building Rings custom silicon from the ground up. We work in a vertically integrated environment where you see your work directly impact the products millions of customers rely on daily.

- 8 years of ASIC implementation synthesis STA and physical design in deep sub-micron nodes (16nm or smaller) experience
- Masters degree in Computer Science Computer Engineering or Electrical Engineering or experience in low power design techniques
- Experience leading or solely developing methodology and scripts for physical synthesis
- Experience managing physical design deliverables with ASIC design partners or foundries
- Familiar UPF/SDC verification and DFT/ATPG test coverage

- Experience in RTL coding and debug as well as performance power area analysis and trade-offs
- Experience with modern ASIC/FPGA design and verification tools
- Experience with SOC bring-up and post-silicon validation
- Experience with IR drop analysis and EM/reliability sign-off

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.


Required Experience:

IC


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