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Senior Thermal Engineer

Hireroo


Job Location:

Barcelona - Spain

Monthly Salary: Not provided by the employer
Posted: 7 October 2026 (Yesterday)
Application Deadline: 4 January 2027
Vacancies: 1 Vacancy

Job Summary

Job Description

Our partner is looking for a Senior Thermal Engineer to own the thermal architecture for advanced compute hardware from die and package level analysis through liquid cooling sled design and rack level heat rejection.

This is a senior individual contributor role with strong technical ownership. You will define thermal budgets cooling requirements and validation methods working closely with mechanical power and hardware teams.

Location: Barcelona Spain Hybrid
Level: Senior

Responsibilities
  • Own thermal design from silicon to rack level

  • Define thermal budgets for high power compute hardware

  • Model die hotspots package spreading and board level thermal behaviour

  • Run CFD and conjugate heat transfer simulations

  • Perform transient analysis using realistic workload power profiles

  • Design cold plates manifolds and liquid cooling loops

  • Define flow rate pressure drop and coolant requirements

  • Specify TIM stack bond line and thermal interface requirements

  • Define sled and rack thermal architecture

  • Set coolant distribution redundancy and failure response requirements

  • Own thermal validation on real hardware

  • Correlate simulation results with sensor and test measurements

  • Work with mechanical power and cooling partners

  • Support thermal telemetry throttling and power management decisions

Requirements
  • 8 years of electronics thermal engineering experience

  • Background in high power computing data centres or similar electronics

  • Thermal ownership of processors GPUs ASICs or FPGAs

  • Strong package level thermal analysis

  • Strong CFD and thermal simulation experience

  • Icepak Flotherm Star CCM or equivalent

  • Liquid cooling and cold plate design

  • Flow and pressure budget experience

  • TIM selection and bond line knowledge

  • Thermal interface reliability understanding

  • Practical thermal validation experience

  • Strong simulation to measurement correlation skills

Optional / Desired
  • 2.5D interposer or chiplet thermal design

  • Two phase cooling

  • Immersion cooling

  • Direct to chip cooling

  • OCP rack cooling experience

  • Facility water interface design

  • Electro thermal simulation

  • Power delivery or PDN collaboration

  • Python for automation and test analysis

Whats in it for you
  • Flexible working hours

  • Hybrid model 4 days office 1 day from home

  • 1 week per year working from anywhere

  • 25 days annual leave plus December 24 and 31

  • Monthly food allowance

  • Private medical insurance

  • Relocation bonus

  • Housing search support

  • Visa support if required

  • Family relocation support

  • Virtual shares

  • Language classes

  • Tax incentive subject to eligibility


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