Senior Mechanical Engineer

Our partner is looking for a Senior Mechanical Engineer to take ownership of the mechanical architecture for advanced compute hardware covering everything from package attachment and socket design through sled chassis and rack integration.

This is a senior individual contributor role with significant design ownership. You will define the mechanical approach work closely with thermal PCB and electrical teams and help take complex hardware from concept through validation and production.

Location: Barcelona Spain Hybrid
Level: Senior

• Own socket lid stiffener and retention design for advanced processor packages

• Define mechanical load limits interface pressure and package support strategy

• Model package and board deflection warpage and structural behaviour

• Design sleds chassis brackets rails and rack structures

• Ensure serviceability airflow and cable routing requirements are considered

• Perform tolerance stack analysis and define GD&T

• Run structural thermal mechanical shock and vibration FEA

• Support cold plate mounting and thermal interface design

• Work closely with PCB SI/PI and thermal engineering teams

• Coordinate DFM and DFA activities with ODM CM and tooling partners

• Support prototype builds validation production ramp and field issue investigation

• Drive mechanical designs through to volume production

• 8 years of mechanical design experience

• Background in servers data centres networking equipment or high power electronics

• Strong package level mechanical experience

• Experience with sockets retention hardware stiffeners and package warpage

• Understanding of interface pressure and mechanical load control

• Strong 3D CAD experience with Creo NX or SolidWorks

• Strong GD&T knowledge

• Proven ownership of tolerance stack analysis

• FEA experience across structural thermal and dynamic load cases

• Experience with shock and vibration requirements

• Experience working with ODM CM or tooling vendors

• Experience supporting designs through production

• Ability to understand the interaction between mechanical load thermal performance and electrical reliability

• 2.5D interposer or advanced substrate package experience

• Liquid cooling and cold plate mechanical design

• Manifold design experience

• OCP rack and sled architecture

• ORv3 or similar hyperscale hardware standards

• Shock and vibration test planning

• Correlation of simulation models with physical test results

• Python or scripting for CAD automation and analysis

• Flexible working hours

• Hybrid model 4 days office 1 day from home

• 1 week per year working from anywhere

• 25 days annual leave plus December 24 and 31

• Monthly food allowance

• Private medical insurance

• Relocation bonus

• Housing search support

• Visa support if required

• Family relocation support

• Virtual shares

• Language classes

• Tax incentive subject to eligibility