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Package Process Development Engineer

Onsemi


Job Location:

Carmona - Philippines

Monthly Salary: Not provided by the employer
Posted: 6 November 2026 (6 hours ago)
Application Deadline: 3 February 2027
Vacancies: 1 Vacancy

Job Summary

Description
  • Lead R&D initiatives focused on die preparation processes like but not limited to laser groove / ablation mechanical dicing stealth dicing.
  • Collaborate with cross-functional teams to drive innovation and integrate new process technologies.
  • Design and conduct experiments to develop and refine packaging processes.
  • Analyze experimental data to identify trends and optimize process parameters.
  • Develop comprehensive process documentation and control plans.
  • Address and resolve complex process-related challenges.
  • Stay abreast of the latest advancements in semiconductor packaging and incorporate cutting-edge techniques.
  • Mentor and provide technical leadership to junior engineers and team members.
  • Ensure all R&D activities comply with industry standards and company policies.


Qualifications
  • Education
    • Bachelors or Masters degree in Electrical Engineering Materials Science Mechanical Engineering or a related field.
  • Experience
    • Minimum of 8 years of experience in semiconductor package assembly process development.
    • Experience in Project Management is a plus.
  • Skills
    • In-depth knowledge of wafer singulation processes semiconductor packaging technologies and materials.
    • Proven track record in process development and efficient use of methodologies.
    • Strong analytical and problem-solving skills.
    • Excellent communication and collaboration abilities.
    • Familiar with Project Management concepts and tools.




Required Experience:

IC


About Company

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and ... View more

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