Chief Engineer, Process

• The Mold Process Chief Engineer is a senior technical leader responsible for driving world-class manufacturing performance through advanced Mold process tooling and equipment optimization. This role leads strategic initiatives focused on yield improvement quality excellence cost reduction productivity enhancement and process robustness. The ideal candidate possesses deep expertise in Mold equipment mold tooling design and qualification process development and semiconductor assembly manufacturing while collaborating across global teams to achieve business objectives and customer satisfaction.

• Lead and drive Mold process tooling and equipment improvement initiatives to enhance yield quality productivity cost performance and process capability.
• Serve as the technical expert for Mold tooling design qualification optimization maintenance strategy and troubleshooting across manufacturing operations.
• Develop optimize and implement robust Mold processes using statistical and engineering methodologies including SPC DOE FMEA MSA and structured problem-solving techniques.
• Drive process characterization equipment evaluations tooling qualifications and technology transfers for new products and process enhancements.
• Lead investigations and corrective actions for customer complaints production excursions OQA findings and Mold-related quality issues.
• Own Mold yield performance by identifying and eliminating defect mechanisms through data-driven analysis and continuous process optimization.
• Define equipment specifications and collaborate with suppliers on Mold equipment and tooling improvements upgrades and technology roadmaps.
• Develop and maintain process documentation including FMEA Control Plans Work Instructions Best Known Methods (BKM) and standardized manufacturing practices.
• Partner with global engineering operations quality maintenance and supply chain teams to drive process standardization and operational excellence.
• Mentor and develop Mold Process Engineers through technical coaching training and best-practice sharing.

• Bachelors Degree in Engineering with 8 years of semiconductor assembly manufacturing experience with extensive exposure in Mold Process Engineering both auto-molding and manual molding.
• Strong expertise in Transfer Molding processes Mold equipment platforms mold tooling design tooling qualification tooling maintenance strategies and Epoxy Molding Compound (EMC) materials.
• Hands-on experience with leading Mold equipment suppliers and platforms including equipment setup optimization troubleshooting and process characterization.
• Demonstrated experience in tooling development cavity balancing mold chase optimization runner/gate design evaluation and defect reduction initiatives.
• Proficiency in statistical and engineering tools such as Minitab JMP SPC DOE FMEA MSA DFM Six Sigma and Root Cause Analysis methodologies.
• Extensive knowledge in problem solving methodology i.e. 8D report DMAIC Phenomena Mechanism approach and the like.
• Proven track record in delivering yield improvement cost reduction process optimization and manufacturing excellence programs.
• Strong analytical and troubleshooting capabilities with the ability to resolve complex process equipment and tooling-related challenges.
• Excellent project management leadership and stakeholder management skills within a cross-functional and global environment.
• Strong communication and presentation skills with the ability to influence technical and business decisions.
• Proficiency in Microsoft Office applications including data analytics (i.e. Spot fire).

Why work for us:

• Competitive salary and benefits package.
• Opportunities for professional development and growth.
• A commitment to workplace safety and employee well-being.
• An innovative and dynamic work environment