Staff Product Package Engineer

Sustaining Staff Product Package Engineers ensures product continuity after mass production by manage SPS controllers and various AI products lifecycle resolving production package process issues and improving COGS.  We are seeking a Package Expert to join our team with a primary focus on sustaining engineering activities. This role is critical in ensuring the long-term quality reliability and manufacturability of our power IC products. The ideal candidate will collaborate with cross-functional teamsincluding design test manufacturing package and qualityto support mature products in high-volume production drive package design improvement resolve customer issues and extend product lifecycle.

Key Responsibilities

• Product owner to multiple products lifecycle.
• Oversees high volume AI Products mass production assembly line readiness manufacturing execution across all internal factory and subcons
• Monitor and resolve manufacturing issues working closely with fab assembly and test sites.
• Sustaining Product COGS improvement and process optimization such as Yield/Volume/Test Time/failure improvements. Improve Test process and prevent potential quality excursions.
• Manage and mitigate risk in MRB / PCRB (Process Change Review Board) to keep delivery by supporting product qualifications second-source/material changes and process migrations/improvements.
• Cross function interface with Operation QA Reliability Factory and OSAT.

Requirements:

• Proven track record of successful Package Development execution and/or Assembly line introduction for high volume mass production manufacturing factory and subcons

Qualifications :

• At least have a minimum of 5 years experience in package development and process engineering
• Bachelors Degree Engineering in Mechanical Electrical/Electronic Physics Materials or related fields
• Experience in product ramp execution bill of material readiness equipment capacity planning process optimization and prevent potential quality excursions.
• Experienced in process engineering or package development of material/process/design
• Experience in CuClip thin die assembly processes SPS solder attach processes.
• Highly self-motivated adaptable and good time management skill
• Proficient in Data manipulation and analysis skill. Familiar with JMP PDF Exenso is a plus.
• Need to work onsite.
• Must have good verbal and written communication skills in English.
• Good interpersonal communication and collaboration skills. 

Additional Information :

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industrial Infrastructure and IoT shaping a safer healthier greener and smarter future.

At Renesas TAGIE is our culture grounded in being Transparent Agile Global Innovative and Entrepreneurial. It shapes how we work grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Remote Work :

No

Employment Type :

Full-time