Semiconductor Package Competitive Analysis Intern
Kuala Lumpur - Malaysia
Job Summary
Role Summary
Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies market trends and competitor activities.
Key Responsibilities
- Perform structured data mining of competitor product releases PCNs teardown reports and technology announcements
- Develop insights on packaging trends cost/performance positioning and technology differentiation
- Conduct startup and emerging technology evaluations relevant to advanced packaging
- Consolidate findings into clear executive-ready reports and dashboards for PI leadership
- Maintain and enhance competitive analysis databases and tracking frameworks
Additional Exposure
- Participate in ATKL manufacturing projects to gain foundational understanding of semiconductor assembly processes
Qualifications
- Degree candidate in Materials Science Mechanical Electrical Engineering or related field
- Strong analytical mindset with ability to synthesize large datasets into actionable insights
- Proficient in Excel and PowerPoint; data analysis or visualization experience preferred
- Familiarity with AI tools and advanced search techniques for efficient data mining is highly desired
- Strong communication skills with ability to clearly present findings
Required Experience:
Intern
About Company
NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.