Enter a job title or keyword

Package Roadmap Tool Intern – Package Innovation

NXP Semiconductors


Job Location:

Kuala Lumpur - Malaysia

Monthly Salary: Not provided by the employer
Posted: 15 September 2026 (2 hours ago)
Application Deadline: 13 December 2026
Vacancies: 1 Vacancy

Job Summary

Package Roadmap Tool Intern Package Innovation

Role Summary
Develop and enhance tools to enable structured definition visualization and management of package technology roadmaps across platforms.

Key Responsibilities

  • Design and implement a Package Roadmap Tool to track technology evolution capabilities and platform alignment
  • Participate and support Platform Manager lead to integrate inputs from business lines competitive analysis and supplier data into a centralized roadmap framework
  • Improve data structure usability and automation of roadmap tracking (e.g. dashboards visualizations)
  • Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy cost targets and technology readiness
  • Collaborate cross-functionally with platform API and manufacturing teams

Additional Exposure

  • Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows

Qualifications

  • Degree candidate in Computer Science (preferred) Engineering or related field
  • Strong programming and data structuring skills (e.g. Python data tools automation frameworks)
  • Experience with Excel Power BI or similar tools for visualization and tool development
  • Ability to translate technical inputs into structured scalable frameworks
  • Self-driven with strong collaboration and communication skills


More information about NXP in Malaysia...

#LI-633a

Required Experience:

Intern


About Company

Company Logo

NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.

View Profile View Profile