Principal Design Engineer

As aPrincipalDesign Engineer in the NVE Design EngineeringCoregroup at Micron Technology Inc. you willcontribute to thedevelopment of memory productsthat are best-in-class usingyour specialized knowledgeandMicron proprietary methods of designing and analyzingcoreand mixed circuits used in the development of memory products!

Whats Encouraged Daily:

• Serve as a technical authority in the analog/corefunctional team for NAND projectsparticipatingin pathfindingactivitiesand solving sophisticated technical problems.

• Collaborate on architectingNANDXpathYpath algorithms waveformsdrive alignment of design solutions methodologiesDTCOand circuits including detailed competitive analysis (CA)across a distributed matrix organization working closely with other functional teams to evaluate analyzeand improve NAND power consumptions across geographies and time zones.

• Collaborateon designing simulatingoptimizing and floor planning NAND circuitsevaluatingdesign feasibility andanalyzecircuit functionalities.Perform die size cost and benefits analysis of new array circuits and algorithms prior to implementation.

• Implementinganalog and mixed signal circuit design to meet specificationsvalidatingdesign performance and functionalities by running block and chip level simulations using standard industry simulatorsandmentorother engineers for the same.

• Develop andproductizeagentic enablement for circuit design including AI/LLM-assisted flows that support: 1. Environment setup and self-healing configuration 2. Guided simulation and debug 3. Intelligent corner planning and coverage closure4. Automated schematic/layout checks and reviewassistance5. Documentation synthesis and knowledge retrieval from internal sources.6. Block/subsystem/full-chip verification (analog/mixed-signal) including reproducible runrecipes golden reference management and regression gating criteria.

• Review existing and generate new user documentation.

• Working withand supportingthe efforts of groups such as Product Engineering Test Probe Process Integration Assembly and Marketing to proactively design products to optimize all manufacturing functions and assure the best cost quality reliability time-to-market and customer satisfaction.

Minimum Qualifications:

• MS(PhD preferred)in electrical engineering.

• 8 years of NAND design relevant proven experiencewith proficient knowledge ofNand Flash memory read program and erase algorithms

• Averyhighlevel of self-motivationandproactivity.

• Proficiencyin analog/mixed signal circuit design(page buffers block selectorsXdecoderYdecoderbias table and waveformsPDNs level shifters IO buffers RTL Verilog)

• Proficientfundamentals in semiconductor and device physics and analog/mixed-signal circuit design.An understanding of semiconductor reliability issues including CHC NBTI stress and snapback as well as Electromigration (EM) and IR analysis.

• Proficientcircuit debugging and problem-solving skills.

• Proficiencyincircuit verification and optimization layout planning parasitic extractions of the circuits experienceguiding layout.

• Proficient inanalog and digital simulators such as HSPICE Fast SPICE andVerilog

• Proficientcoding skills in Python (plus Bash/Tcla bonus) andproficientworking with structured data (CSV/JSON/SQLite) and version control.

• ProficientwithCadence design LVS/DRCtoolsand UNIX.

• Excellent teamwork attitude.Good verbal communication skills (English) and ability to convey sophisticated technical concepts in verbal and written form.