Semiconductor Assembly Process Development Engineer

Our company actively drives technological innovation in semiconductor back-end processes with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP).

In rapidly growing fieldsincluding AI high-performance computing (HPC) automotive and IoTthere is increasing demand for packaging solutions with higher density enhanced reliability and superior thermal response we are accelerating the development of advanced technologies such as FCCSP (Flip Chip Chip Scale Package) and FCBGA (Flip Chip Ball Grid Array).

As device architectures become more complex and multifunctional expanding our technological capabilities and strengthening our development organization are essential. To support this growth we are seeking engineers with expertise in semiconductor back-end processes.

This role offers the opportunity to work at the forefront of innovationdeveloping high-density high-heat-dissipation packages for AI/HPC as well as high-reliability solutions for automotive and IoT applicationsand to contribute to technologies that underpin transformative advancements such as AI and autonomous driving.

You will be responsible for technology development in semiconductor back-end processes including assembly packaging and testing:

• Development and evaluation of advanced packaging technologies including FCCSP and FCBGA
• Material and process development as well as improvement of assembly processes (e.g. molding strip grinding ball mounting marking and package sawing)
• Support for production line setup and transition to mass production
• Driving process quality improvements and yield enhancement activities

Qualifications :

MUST

• Minimum of 5 years of experience in technology development for semiconductor back-end processes (assembly and packaging)
• At least 5 years of experience in technology development in one or more of the following processes: Molding Strip Grinding or Package Sawing
• Hands-on experience in process improvement quality control and equipment introduction/implementation
• Bachelors degree or above in a technical field such as Mechanical Engineering Materials Science Electronics Chemistry or a related discipline

Language

• Japanese: Business-level proficiency required with the ability to participate in meetings engage in technical discussions and communicate effectively with internal and external stakeholders
• English: Approximately TOEIC 700 level with the ability to communicate effectively in a business environment particularly in reading and writing

WANT

• Experience in developing packages for AI / HPC applications particularly with a focus on high-reliability design
• Experience in the development of advanced packaging technologies such as FCBGA FCCSP or FCLGA
• Experience working with and meeting quality standards such as ISO or IATF

Additional Information :

ルネサスはTo Make Our Lives Easier人々の暮らしをより豊かで快適にするというPurposeのもと組込み半導体ソリューションを提供するグローバル企業です世界30か国以上で活躍する21000人を超えるエンジニアや課題解決のプロフェッショナルとともに自動車産業インフラIoT分野における世界最先端のテクノロジー開発に携わりより安全で健康的で環境にやさしくスマートな未来の実現に貢献しています 

ルネサスではTAGIETransparentAgileGlobalInnovativeEntrepreneurialを企業文化の中核としていますTAGIEは私たちの働き方や成長のあり方そしてPurposeの実現に向けた取り組みを支える共通の価値観ですこの協調的な精神と挑戦するマインドセットが半導体技術を通じた産業の変革と世界中の人々の暮らしへの貢献を可能にしています 

私たちは競争力のある報酬制度に加え充実した福利厚生をご用意しています福利厚生の詳細については選考プロセスの中でご案内いたします 

私たちとともに未来を創造する挑戦にぜひ参加しませんか皆さまからのご応募をお待ちしております 

Remote Work :

No

Employment Type :

Full-time