Mechanical Engineering

Lead the system-level mechanical architecture design integration and validation of precision patterning semiconductor equipment. Translate process and product requirements into robust mechanical solutions that achieve sub-micron accuracy thermal stability process uniformity reliability and manufacturability. Own system performance across motion thermal structural fluidic substrate handling and controls interfaces

• Define system architecture requirements interfaces performance budgets and verification strategies.
• Translate process and customer requirements into subsystem specifications and measurable performance targets.
• Drive system integration and ensure compliance with performance throughput reliability safety and cost objectives.

• Design and integrate precision motion systems substrate handling modules process assemblies tooling fixtures and gas delivery systems.
• Develop solutions for positioning accuracy alignment flatness vibration control structural stiffness and thermal stability.
• Design relevant jigs & fixtures to achieve the precision & system calibration procedures.
• Create and release engineering documentation drawings and specifications using NX and PLM tools.

• Perform thermal structural flow tolerance stack-up and FEA-based analyses to validate designs.
• Define system verification plans acceptance criteria and qualification methodologies.
• Lead characterization troubleshooting root-cause analysis and corrective actions for system-level issues.
• Establish and monitor key performance metrics including accuracy repeatability overlay uniformity throughput and uptime.

• Partner with Process Controls Electrical Automation Manufacturing Quality and Service teams throughout product development.
• Lead technical reviews design trade-offs and risk assessments.
• Collaborate with suppliers on critical precision components and subsystem development.
• Mentor engineers and provide technical leadership across the platform.

• Proven experience developing semiconductor lithography printing metrology inspection or other high-precision capital equipment.
• Strong understanding of:
  • Precision motion systems
  • Error budgeting and alignment strategies
  • Structural dynamics and vibration control
  • Thermal stability and thermal management
  • Requirements engineering interface management and system verification
  • P&ID Pneumatics & electrical schematics.
  • SEMI standards & compliances

• Expertise in:
  • Heat transfer and thermal management
  • Structural mechanics
  • Precision assemblies
  • Gas flow and pneumatic systems
  • Materials selection and manufacturing processes
• Proficiency in GD&T tolerance analysis ASME standards FMEA/FMECA and DFX methodologies.

• Working knowledge of structural thermal modal vibration and flow analysis.
• Ability to correlate simulation results with experimental data.
• Advanced proficiency in UG NX and Teamcenter.

• Atmospheric semiconductor patterning equipment.
• Inkjet printing direct-write lithography plasma deposition or advanced packaging systems.
• Precision stage design mechatronics and closed-loop motion control.
• Semiconductor contamination control cleanroom practices and safety interlock architectures.
• Vacuum systems knowledge.

• Bachelors degree in Mechanical Engineering (Masters preferred).
• 812 years of experience in semiconductor or precision capital equipment development.
• Demonstrated success delivering system-level mechanical solutions from concept through production.

A highly accomplished system mechanical engineer with a proven track record in precision patterning equipment capable of architecting and delivering integrated solutions across motion thermal structural and fluidic domains while driving product performance reliability and manufacturability from concept to high-volume production.