PhD for R&D CMOS Integration

GlobalFoundries


Job Location:

Dresden - Germany

Monthly Salary: Not Disclosed
Posted on: 7 hours ago
Vacancies: 1 Vacancy

Job Summary

As a PhD candidate in R&D CMOS Integration you will conduct advanced research on the development and optimization of ferroelectric HfO₂-based devices for nextgeneration memory and AI applications.

Core Research Topics

Ferroelectric HfO₂ Devices (FeFET / FeCAP)

  • Optimization of HfO₂ thin films for stable ferroelectric behavior and investigation of polarization switching retention endurance and variability.

  • Device-level physics analysis of ferroeletricity based CMOS embedded devices and in-memory computing applications.

  • Exploration of integration schemes into advanced FDSOI (FDX) and bulk CMOS technologies.

Advanced Characterization & Materials Analysis

  • Structural and electrical analysis using: TEM / STEM (including advanced contrast techniques such as DPC) / SEM and nanoscale imaging tools

  • Electrical device and simple circuit characterization and mapping the results to structural data.

Required Qualifications

  • Masters / Diplom degree in Materials Science Physics Electrical Engineering or a related discipline

  • Strong expertise in semiconductor materials analysis and nanostructure characterization.

  • Hands-on experience with TEM / STEM /SEM characterization FIB preperation and analysis are beneficial.

  • Experience in data analysis using Python

  • Background in semiconductor device physics (e.g. MOSFETs ferroelectric devices)

  • Exposure to HfO₂-based ferroelectric devices / FeFETs are desirable

  • Proven research capability through Thesis work at leading research institutes and Scientific publications or conference contributions

What We Offer

  • Direct supervision within the Technology Architect /TD Group at GlobalFoundries Dresden

  • Access to state-of-the-art semiconductor fabrication and characterization infrastructure

  • Opportunity to work at the forefront of Ferroelectric memory technologies and AI hardware and in-memory computing

  • Strong collaboration with internal R&D device engineering and external research partners

  • Opportunity to publish in leading journals and present at top-tier conferences

  • Integration into one of Europes leading semiconductor research ecosystems

Key Details

  • Start Date: October 1st 2026; limited contract for 3 years.

  • Location: GlobalFoundries Dresden F1.

  • Degree: PhD (in cooperation with a partner university e.g. TU Dresden)

Information about our benefits you can find here:

As a PhD candidate in R&D CMOS Integration you will conduct advanced research on the development and optimization of ferroelectric HfO₂-based devices for nextgeneration memory and AI applications.Core Research TopicsFerroelectric HfO₂ Devices (FeFET / FeCAP)Optimization of HfO₂ thin films for stable...

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