Staff Package Design Engineer Substrate

• Design and develop package and interconnect methods for Renesass packaging needs in the areas of Power SiP/modules wafer level chip scale package  flip-chip multi-chip module LGA and power device packaging.
• Experience of embedded substrate development which has FET die & IC driver & capacitors.
• Package technologies qualification for consumer & industrial power as well as automotive power applications.
• Benchmark select and qualify suitable materials processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT/CM  to develop run DOE to optimize processes and establish process spec.
• Work with Product groups and Reliability team qualify new packages and processes within required time frame.
• Resolve all process integration issues by ensuring all window checks are done on critical process steps.
• Establish production controls and monitor to ensure there is no room for quality incidents.
• Ensure smooth transition into production & implement ramp up monitor.  
• Work with OSAT/CM  to monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer.
• Develop and maintain technical expertise on advances and innovations in power SiP/modules wafer level packaging & flip chip interconnects.
• Participate in packaging roadmap development & focus on execution.
• Address internal and external customer complains working with peers of Marketing Product groups Quality and Operations organization to satisfy growth in businesses.
• Establish & maintain package design rules.

Qualifications :

Doctorate/Masters / Bachelor Degree in Physics Chemistry Mechanical Electrical or Materials Engineering.
6-12 years of relevant experience in package development emphasizing power SiP/module wafer level & flip-chip packaging.
Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor assembly process knowledge qualification methods SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.


 

Additional Information :

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industrial Infrastructure and IoT shaping a safer healthier greener and smarter future.

At Renesas TAGIE is our culture grounded in being Transparent Agile Global Innovative and Entrepreneurial. It shapes how we work grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Remote Work :

No

Employment Type :

Full-time