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Principal Product Engineer Memory IP

Cadence Systems


Job Location:

Nanjing - China

Monthly Salary: Not provided by the employer
Posted: 19 August 2026 (30+ days ago)
Application Deadline: 16 November 2026
Vacancies: 1 Vacancy

Job Summary

At Cadence we hire and develop leaders and innovators who want to make an impact on the world of technology.

Primary Responsibilities:
Supporting pre-silicon integration usage and implementation of memory subsystem products
Helping with internal system integration and QA testing of memory subsystem products (Controller PHY)
Analyzing and resolving complex subsystem application or implementation issues and providing
professional guidance to customers
Supporting various memory PHY and controller SOC integration reviews and implementation reviews
Assisting customers with RTL and gate-level simulations to verify functionality
Assisting customers with timing closure and other aspects of physical integration
Participating in development and refinement of product documentation and checklists for customer
applications
Supporting post-silicon bringup and production test activities for customers as needed
Enhancing customer experience by providing prompt thorough and technically accurate responses to
customer questions
Leveraging AI-powered tools and assistants to enhance productivity improve decision making and maintain
high-quality customer deliverables.
Applying AI-powered analytics tools to extract insights identify patterns and generate actionable
recommendations from complex datasets

Position Requirements:
B.S Electrical/Computer Engineering (or similar degree) and 7 years of overall experience -OR- M.S
Electrical/Computer Engineering (or similar degree) and 5 years of overall experience
Experience working with DDR5/4/3 LPDDR5/4/3 HBM3 GDDR6 or similar IPs
Verilog RTL design and gate level verification experience
Synthesis and static timing analysis experience (physical implementation/verification experience is a plus)
Familiarity with industry standard DFT flows and test methodologies.
Familiarity with package and board design
Ability to read schematics and participate in SI/PI reviews for customer board/package implementation

Preferred Qualifications
Experience with Memory PHY and DSP based architecture
Experience with embedded microcontroller FW
Background with scripting and applying AI solutions to daily workflows

Were doing work that matters. Help us solve what others cant.

Required Experience:

Staff IC


About Company

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Do you want to shape the future of technology? Cadence is leading the charge to solve some of technology’s toughest challenges. We work with the world’s most innovative companies, across a growing range of industries. Major trends that you hear about everyday – like artificial intell ... View more

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