NXP Semiconductors

Design and implement standard-based and proprietary Bluetooth/BLE host stack and controller f/wLead architecture and design of complex Bluetooth/BLE system level use cases for auto/gaming/IOT customers.Bluetooth/BLE/15.4 SoC development and bring-upWork with the teams in various locat

Design and implement standard-based and proprietary Bluetooth/BLE host stack and controller f/wLead architecture and design of complex Bluetooth/BLE system level use cases for auto/gaming/IOT customers.Bluetooth/BLE/15.4 SoC development and bring-upWork with the teams in various locat

IntroductionThe Systems Innovation Automotive (SI A) of NXP Eindhoven focuses on first-of-a-kind system applications & system prototypes to demonstrate new applications and use cases based on NXP components. SI A is part of the Central Technology Organization (CTO) department System I

IntroductionThe Systems Innovation Automotive (SI A) of NXP Eindhoven focuses on first-of-a-kind system applications & system prototypes to demonstrate new applications and use cases based on NXP components. SI A is part of the Central Technology Organization (CTO) department System I

Job Summary:The Digital Physical Design Engineer / Architect is responsible for a physical implementation of IP Subsystem or IC design. The individual is responsible from RTL synthesis to GDS implementation and optimization of design including floor planning Placement CTS routing timi

Job Summary:The Digital Physical Design Engineer / Architect is responsible for a physical implementation of IP Subsystem or IC design. The individual is responsible from RTL synthesis to GDS implementation and optimization of design including floor planning Placement CTS routing timi

Generic Job Description (not Job Level specific): The Design Methodologies and Tools Engineer / Architect develops and applies Computer Aided Design (CAD) software engineering methods theories and research techniques in the investigation and solution of technical problems. Assesses ar

Generic Job Description (not Job Level specific): The Design Methodologies and Tools Engineer / Architect develops and applies Computer Aided Design (CAD) software engineering methods theories and research techniques in the investigation and solution of technical problems. Assesses ar

Product / Test Engineer (NPI/NTI) New College GraduateAbout the RoleJoin our Product/Test Engineering team and help bring new semiconductor products from concept to highvolume manufacturing. You will develop test solutions perform product characterization and qualification and collab

Product / Test Engineer (NPI/NTI) New College GraduateAbout the RoleJoin our Product/Test Engineering team and help bring new semiconductor products from concept to highvolume manufacturing. You will develop test solutions perform product characterization and qualification and collab

Department: Advanced Power Systems (APS). This role emphasizes Advanced Power Management System IC Architecture for Point of Load (PoL) solutions.Role OverviewWe are seeking a visionary System IC Architect with deep expertise in system-level architecture high-performance power convers

Department: Advanced Power Systems (APS). This role emphasizes Advanced Power Management System IC Architecture for Point of Load (PoL) solutions.Role OverviewWe are seeking a visionary System IC Architect with deep expertise in system-level architecture high-performance power convers

The Future Starts Here Shape Security Innovation at NXP!Are you ready to influence the security architecture of technologies that power the worldJoin NXPs Competence Center for Crypto & Security and help define secure solutions that span our entire product portfolio.We are looking fo

The Future Starts Here Shape Security Innovation at NXP!Are you ready to influence the security architecture of technologies that power the worldJoin NXPs Competence Center for Crypto & Security and help define secure solutions that span our entire product portfolio.We are looking fo

We are looking for a highly motivated student that will help us with developing new methods of testing and investigating the boundaries of the capabilities of IC packages related to thermo-migration and electro-migration. Those packages might be exposed to high temperature and/or curr

We are looking for a highly motivated student that will help us with developing new methods of testing and investigating the boundaries of the capabilities of IC packages related to thermo-migration and electro-migration. Those packages might be exposed to high temperature and/or curr