Senior IC Package mechanical and thermal design engineer

Annapurna Labs is a semiconductor company established by semiconductor industry veterans and is now part of Amazon Web Services (AWS).
We are developing leading edge products manufactured on leading edge technologies.
We offer a dynamic open teamwork environment operating at high pace mode.

Key job responsibilities
Assume full ownership of mechanical and thermal design of Annapurna ICs.
Engage with product architect and design teams on future products package and assembly needs
Perform package level thermal simulations.
Perform package level mechanical simulations.
Lead and design thermal and mechanical measurements of ICs.
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.


About the team
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- Bachelors degree in Electrical Engineering or a related field
- Masters degree in Mechanical or Electrical Engineering or a related field

- Knowledge of SoC architecture
- Experience with microelectronic packaging

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