وظائف مهندس تصميم الأجهزة في International

Montagebriefings & VorbereitungErstellung prziser Briefings fr die Terminvorbereitung von MontageeinstzenVerantwortung fr die vollstndige und korrekte Erstellung der MontagebriefingsErkennung fehlerhafter Briefings und Weiterleitung an die zustndige Fachabteilung zur KorrekturEigenstndiges Arbeiten...

Position: Fire Protection Design EngineerLocation: Oshawa ON (Onsite)Structure: Contract 24 months to startPay:$70.00 - $80.00 p/h inc. HST--We have a great new opportunity to support one of our Energy Sector clients in a contract capacity!Please see below for more information on the position and i...

Position: Fire Protection Design EngineerLocation: Oshawa ON (Onsite)Structure: Contract 24 months to startPay:$70.00 - $80.00 p/h inc. HST--We have a great new opportunity to support one of our Energy Sector clients in a contract capacity!Please see below for more information on the position and i...

Job Title: Structural Design Engineer Location: Wichita KS 67210 Duration: 6 Months Description: Duties: Apply knowledge of engineering and physical science principles materials and tools in a collaborative environment to develop integrate document and evaluate flight vehicle structure designs...

Role: Design Engineer Closures Engineering Location: Warren MI 48092 Duration: 6 months (can extend) 100% on-site Looking for someone with 5-10 years exp Looking for sheet metal domain. Must Have Skills: Own CAD design of closure systems and components in Siemens NX / Teamcenter (or equivalent...

1. IC Packaging Design Engineer Location Work Mode & Experience Location: Chandler Arizona OR Hillsboro Oregon (Onsite) Employment: Long-Term Contract (12 Months) Experience: 4 6 Years Role Overview We are seeking an IC Packaging Design Engineer with experience in advanced semiconductor package de...

2. Senior IC Packaging Design Engineer Location Work Mode & Experience Location: Chandler Arizona OR Hillsboro Oregon (Onsite) Employment: Long-Term Contract (12 Months) Experience: 6 10 Years Role Overview We are looking for an experienced IC Packaging Design Engineer to develop advanced semicond...

Job Title: Structural Design Engineer Location: Wichita KS 67210 Duration: 6 Months Description: Duties: Apply knowledge of engineering and physical science principles materials and tools in a collaborative environment to develop integrate document and evaluate flight vehicle structure designs...

ROLE AND RESPONSIBILITIES: Design of Prototype bridging components to validate new features as part of Model Year updates. Design of components via additive manufacturing to support Demo / Mule vehicles. Design & modification of components to support Physical Mock-up builds. Design of bespoke to...

Job title: Telecommunications Outside Plant (OSP) Design Engineer Location: Jackson MS 39213 Can be Hybrid (3 days in office/2 days remotely) Duration: 12 months contract Pay range: $55 to $65 an hour (Depends on experience & qualification) Schedule: Standard shift Job Description: Key Responsibi...

Lead / Principal IC Packaging Design Engineer Location Work Mode & Experience Location: Chandler Arizona OR Hillsboro Oregon (Onsite) Employment: Long-Term Contract (12 Months) Experience: 10 Years Role Overview We are seeking a Lead IC Packaging Design Engineer with extensive experience in advanced...

1. IC Packaging Design Engineer Location Work Mode & Experience Location: Chandler Arizona OR Hillsboro Oregon (Onsite) Employment: Long-Term Contract (12 Months) Experience: 4 6 Years Role Overview We are seeking an IC Packaging Design Engineer with experience in advanced semiconductor package de...

Role: Design Engineer Closures Engineering Location: Warren MI 48092 Duration: 6 months (can extend) 100% on-site Looking for someone with 5-10 years exp Looking for sheet metal domain. Must Have Skills: Own CAD design of closure systems and components in Siemens NX / Teamcenter (or equivalent...

2. Senior IC Packaging Design Engineer Location Work Mode & Experience Location: Chandler Arizona OR Hillsboro Oregon (Onsite) Employment: Long-Term Contract (12 Months) Experience: 6 10 Years Role Overview We are looking for an experienced IC Packaging Design Engineer to develop advanced semicond...

Lead / Principal IC Packaging Design Engineer Location Work Mode & Experience Location: Chandler Arizona OR Hillsboro Oregon (Onsite) Employment: Long-Term Contract (12 Months) Experience: 10 Years Role Overview We are seeking a Lead IC Packaging Design Engineer with extensive experience in advanced...

Job title: Telecommunications Outside Plant (OSP) Design Engineer Location: Jackson MS 39213 Can be Hybrid (3 days in office/2 days remotely) Duration: 12 months contract Pay range: $55 to $65 an hour (Depends on experience & qualification) Schedule: Standard shift Job Description: Key Responsibi...

ROLE AND RESPONSIBILITIES: Design of Prototype bridging components to validate new features as part of Model Year updates. Design of components via additive manufacturing to support Demo / Mule vehicles. Design & modification of components to support Physical Mock-up builds. Design of bespoke to...

Who Youll Work WithWorking closely with cross-functional teams including software product management and manufacturing our engineers innovate on system architectures high-speed PCB designs and signal integrity to deliver state-of-the-art products that drive network performance and reliability.What Y...

Qualify Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.Key Responsibilities Design package develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.Ramp up man...

Qualify Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.Key Responsibilities Design package develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.Ramp up man...